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LED display screen and manufacturing method thereof

A technology of LED display screen and manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, transportation and packaging, semiconductor devices, etc., can solve the problems of incompleteness, low production efficiency, differences, etc. Effect

Pending Publication Date: 2020-06-30
XIAMEN SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the SMD packaging, the problem of module color difference can be eliminated by mixing three times, but because of the need for three-stage processes, at the same time, in the first stage of mixing different batches of blue films, a part of the previous batch of blue films needs to be retained for each blue film mixing , which has problems such as low production efficiency, uneven chip mixing, and incomplete
In the field of chip-on-board (COB) packaging, in order to solve the problem of module chromaticity, the current mainstream solution of various packaging manufacturers is to perform chromaticity calibration on the entire screen. It cannot fundamentally solve the problem of module chromaticity difference

Method used

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  • LED display screen and manufacturing method thereof
  • LED display screen and manufacturing method thereof
  • LED display screen and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] In order to solve the problem of brightness difference and color difference between the screens caused by LED sorting in the above-mentioned prior art, this embodiment provides a method for manufacturing an LED flip-chip display screen, such as Figure 2-6 shown, including the following steps:

[0062] Prepare batches of LED chips with the same or different specifications;

[0063] The aforementioned LED chips with the same or different specifications may come from the same wafer or different wafers. In a preferred embodiment of this embodiment, as image 3 As shown, LED chips 301 of the same specification from different wafers are divided into different bins. In an optional embodiment of this embodiment, the LED chips can also be divided into LED chips with the same bin but different brightness or wavelength. In this embodiment, the specification of the LED chip 301 includes at least one of color or brightness.

[0064] Grabbing the aforementioned batches of LED ch...

Embodiment 2

[0081] This embodiment provides a method for manufacturing an LED flip-chip display screen, and the similarities with Embodiment 1 will not be repeated, and the difference lies in:

[0082] In this embodiment, the LED chips can be grabbed illogically from the wafer on which the LED chips are cut out by random sampling method; Any sticky carrier film such as white film, PVC film, etc.; then transfer the LED chips on the carrier film to the circuit substrate in batches; package and assemble the LED chips transferred to the circuit substrate to form an LED display.

[0083] The method shown in the above-mentioned embodiments of the present invention can directly carry out illogical grabbing and then arrange LED chips of the same or different specifications from the same wafer, so the method can directly grab the LED chips without binning, and realize LED chips Scattered and evenly distributed. In addition, this method can also grab and arrange LED chips of the same specification...

Embodiment 3

[0087] This embodiment provides an LED display screen, which includes a display unit, and the display unit includes a circuit substrate and an LED chip welded on the circuit substrate;

[0088] Wherein, the LED chips include LED chips from the same wafer and / or LED chips from different wafers, the LED chips are randomly arranged and welded on the circuit substrate, and the adjacent LED chips are not It includes adjacent LED chips with the same specification, and the specification of the LED chip includes at least one of chromaticity and brightness of the LED chip.

[0089] In a preferred embodiment of this embodiment, the LED chips include flip-chip Mini LED chips or Micro LED chips.

[0090] In another preferred embodiment of this embodiment, the LED display screen further includes a control system, which is electrically connected to the display unit to control the display unit to display according to different requirements.

[0091] In the LED display screen of this embodimen...

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Abstract

The invention provides an LED display screen and a manufacturing method thereof. The method comprises the following steps: preparing batch LED chips with the same or different specifications; carryingout logic-free grabbing on the LED chips through a random sampling method and arranging the grabbed LED chips in sequence; the LED chips arranged in sequence are packaged and assembled to form an LEDdisplay screen; wherein the LED chips in a certain adjacent area in the LED display screen are not all adjacent LED chips with the same specification, and the specification of the LED chips comprisesone of color and brightness. According to the method provided by the invention, the chips with single specification or multiple specifications are subjected to one or more times of non-logical grabbing and arrangement, and the brightness and color difference of the grabbed and arranged chips after subsequent packaging and screen assembling is avoided. Moreover, the method can be realized by nesting a random number table method in the operation of the existing equipment, the realization process is simple, the equipment or the manufacture procedure does not need to be changed or designed, the operation cost is low, and the realization is easy.

Description

technical field [0001] The invention relates to the technical field of LED display screens of LED chip sorting machines, in particular to an LED flip-chip display screen and a manufacturing method thereof. Background technique [0002] In the field of LED display screens, users hope to obtain a clear display effect, and gradually pay attention to the consistency of the whole screen effect. In the point-testing and sorting stage of chip preparation, chips with the same bin specification will be arranged sequentially according to the sorting / arranging logic of the existing technology. When subsequent packaging manufacturers package the above-mentioned chips in sequence and assemble the screen, the problem of chromaticity differences in the entire screen display effect will gradually appear, and there will be brightness differences and color differences between the screens. Therefore, how to eliminate the brightness and color differences between screens has become a key issue ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L33/48H01L27/15
CPCH01L21/67271H01L33/48H01L27/156H01L2933/0033H01L25/0753H01L21/52B65G47/90H01L21/67144H01L33/62H01L2933/0066
Inventor 吴霁圃林宗民邓有财曾合加
Owner XIAMEN SANAN OPTOELECTRONICS CO LTD
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