Drilling and copper deposition all-in-one equipment for processing via holes of circuit boards

Abstract

The invention relates to the field of processing for circuit boards, in particular to drilling and copper deposition all-in-one equipment for processing via holes of circuit boards. The equipment comprises a feeding and discharging mechanism, a drilling mechanism, a transfer mechanism and a copper deposition mechanism. An output end of the feeding and discharging mechanism is connected with an input end of the drilling mechanism, an output end of the drilling mechanism is connected with an input end of the transfer mechanism, and an output end of the transfer mechanism is connected with an input end of the copper deposition mechanism. According to the drilling and copper deposition all-in-one equipment, the multiple circuit boards which are laminated in sequence are quickly and effectivelyfed and discharged through the feeding and discharging mechanism, and the equipment can be matched with the circuit boards different in size through the drilling mechanism so as to complete clampingpositioning and continuous drilling operation on the circuit boards. The circuit boards after being drilled are conveyed to the transfer mechanism, the transfer mechanism transfers the circuit boardsto the copper deposition mechanism to perform chemical copper deposition, and integrated processing of drilling and copper deposition for the via holes of the circuit boards is achieved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to an integrated equipment for drilling and sinking copper used for processing via holes of circuit boards. Background technique [0002] The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. A number of via holes for the installation of electronic components will be drilled on the circuit board. For the via holes, copper sinking treatment is required. Immersion copper is the abbreviation of electroless plating copper (Eletcroless Plating Copper), also called Plated Through hole (PlatedThrough hole) ), abbreviated as PTH, is an autocatalytic redox reaction. After the two-layer or multi-layer board is drilled, the PTH process will be carried out. Immersion copper is to deposit a thin layer of chemical copper on the non-conductive hole wall base mater...

AI Technical Summary

Problems solved by technology

However, the surface copper sinking equipment performs the copper sinking process separately, and the drilling and copper sinking are carried out independently, that is, the drilling is completed by one device, and the copper sinking is completed by another device, which will inevitably result in a reduction in production efficiency. At the same time, it also increases the cost of equipment purchase. If an automated equipment that integrates drilling and copper sinking can be designed, the processing rate of the circuit board can be greatly improved.

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