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High-performance computing data center loop system

A high-performance computing and data center technology, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc. Effect

Inactive Publication Date: 2020-06-16
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the acceleration of technology innovation in my country's data center industry, the level of localization of data centers and servers has been continuously improved, especially for high-performance computing. Because of the increasing heat generation, the traditional air-cooled mode can no longer meet the heat dissipation requirements; therefore, more and more More and more high-performance computing adopts the cold plate cooling mode. In order to reduce the energy consumption of the micro-module data center, improve the cooling efficiency of the data center, and improve the reliability of the data center cooling system, a high-performance computing data center loop is designed. system

Method used

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Embodiment Construction

[0022] In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below through specific implementation methods and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limiting the prese...

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Abstract

The invention discloses a high-performance computing data center loop system, which comprises a micro-module data center system isolated by cold and hot channels, wherein the micro-module data centersystem is internally provided with a cabinet. The high-performance computing data center loop system comprises a heat exchange unit connected with an external cold source, a loop system connected withthe heat exchange unit, and an inter-column air conditioner arranged between cabinet columns, wherein the heat exchange unit is a CDU in the figure. The micro-module data center system is a product integrating systems such as a rack, an air conditioner, power distribution, monitoring and lighting of the traditional machine room, the advantages of modular design are brought into full play, the cooling mode in the cabinet adopts cold plate type cooling, the inter-column air conditioner refrigeration and cold and hot channel isolation technology is adopted, other components such as a hard disk,a memory and a power supply are cooled by adopting an air-cooled inter-column air conditioner (LCU), and the greenization of a data center is realized.

Description

technical field [0001] The invention relates to the field of data center heat dissipation, in particular to a high-performance computing data center loop system. Background technique [0002] Driven by technologies such as mobile Internet, cloud computing, and big data, my country's IDC industry is booming. In recent years, the number of data centers in my country has been increasing, the industrial structure has been gradually optimized, and the ecosystem has been gradually established. With the acceleration of technology innovation in my country's data center industry, the localization level of data centers and servers has been continuously improved, especially for high-performance computing. Because of the increasing heat generation, the traditional air-cooled mode can no longer meet the heat dissipation requirements; therefore, more and more More and more high-performance computing adopts the cold plate cooling mode. In order to reduce the energy consumption of the micro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20745H05K7/2079H05K7/20836
Inventor 王红卫
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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