Patch structure convenient for mounting sheet-shaped component on circuit board

Abstract

The invention discloses a patch structure convenient for mounting a sheet-shaped component on a circuit board, relates to the technical field of component installation, the patch structure comprises asubstrate and a component, a socket is arranged in the middle of an installation area arranged on the surface of the substrate, a pair of clasps is arranged on the lower surface of a positioning plugarranged on the lower surface of the component, and the clasps are inserted into jacks arranged on the socket. According to the invention, the pair of clasps arranged at the bottom of the component is inserted into the jacks formed in the socket, and the hook parts arranged at the lower ends of the two clasps are clamped in the clamping grooves, so that the component is quickly clamped and fixed;according to the utility model, the glue storage cavity is filled with the adhesive glue by pouring the adhesive glue upwards along the glue pouring port, and as the glue storage cavity is in the inverted cone shape, the adhesive glue can be in contact with the lower surface of the component by more areas, the component is reinforced and fixed, and the component is prevented from loosening.

Description

technical field [0001] The invention relates to the technical field of component installation, in particular to a patch structure that facilitates the installation of chip components on a circuit board. Background technique [0002] Traditionally, in the process of installing chip components on the PCB, the components are manually pressed on the mounting area on the PCB, so that the pins of the components are aligned with the pads on the PCB, and then the suction is held by hand. The soldering torch welds the pins to the pads. In the traditional placement process, the positioning and fixing of components is more troublesome, and it is easy to shift between the soldering pin and the pad, resulting in inaccurate alignment. In addition, during the existing placement process, especially the integration When the chip is disassembled, a heating device is required. For example, a high-temperature air gun directly touches the pins, so it is easy to burn the internal body of the chi...

AI Technical Summary

Problems solved by technology

In the traditional placement process, the positioning and fixing of components is more troublesome, and it is easy to shift between the soldering pin and the pad, resulting in inaccurate alignment. In addition, during the existing placement process, especially the integration When the chip is disassembled, a heating device is required. For example, a high-temperature air gun directly touches the pins, so it is easy to burn the internal body of the chip next to the chip pins, and the traditional chip holding structure will greatly compress the available wiring space occupied by the chip coverage area.

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