Cutting device
A cutting device and wafer segmentation technology, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of high equipment cost, and achieve the effect of reducing equipment cost and realizing space saving.
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[0023] Hereinafter, a cutting device according to an embodiment of the present invention will be described in detail with reference to the drawings.
[0024] exist figure 1 shows an overall perspective view of the cutting device 1 of this embodiment, and figure 2 shown in figure 1 A perspective view of the main parts of the cutting device 1 is shown.
[0025] The cutting device 1 has the ability to place and hold the workpiece ( figure 2 The chuck table 10 of the wafer W) shown also has a cutting unit 20 for dividing the wafer W supported by the ring frame F via the respective adhesive tapes T into individual device chips.
[0026] Such as figure 1 As shown, the chuck table 10 can advance and retreat in the X-axis direction shown by the arrow X to be positioned in the loading and unloading area A and the processing area B. In the loading and unloading area A, a wafer W or wafer W is placed and held on the chuck table 10. The chipped wafer W is taken out from the chuck t...
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