Drying oven with air bearings and application method thereof

Abstract

The invention discloses a drying oven with air bearings and an application method thereof. The drying oven comprises an oven body, a conveying portion and a heating portion, wherein the oven body is provided with an inner space and an opening, the inner space is provided with a supporting plate, a feeding hole and a discharging hole correspondingly penetrate through two opposite sides adjacent tothe opening, the conveying portion is arranged on the supporting plate and comprises the plurality of air bearings, the air bearings are rotatably arranged on the supporting plate, a to-be-machined material belt penetrates through the feeding hole and the discharging hole to be attached to all the air bearings, and the heating portion is arranged in the inner space and is used for uniformly heating the material belt, in this way, the effects that in the process where the material belt is heated and the conveying portion conveys the material belt, due to the fact that air bearing supporting wheels are used as conveying media of the material belt, the material belt can be conveyed with low tension, so that the tension deformation of the material belt and sliding friction generated between the material belt and the supporting wheels are reduced, and then the material belt is prevented from being damaged are achieved.

Description

technical field [0001] The present invention relates to a bearing, in particular to an air bearing supported by fluid. Background technique [0002] When the existing flexible printed circuit board (FPC) is produced by the flip chip bonding technology (Chip on Film, COF), it is a kind of Flip Chip Bonding (Flip Chip Bonding) on ​​the flexible circuit. The technology on the board substrate, the driver IC and its electronic parts are directly placed on the film (Film), compared with the traditional printed circuit board, the circuit and diagram of the circuit are made on the rigid substrate by the method of printing etching resist. It can further achieve the purpose of being lighter, thinner and shorter. In the process of flip chip bonding technology, after gluing, it will be initially dried in an oven, but to ensure that the product can be thoroughly dehumidified and the colloid hardened, a long-term baking is required. At this stage, special baking is used. Flexible circui...

AI Technical Summary

Problems solved by technology

[0003] However, the oven in the prior art is provided with a plurality of bearings inside the casing for heating and toasting the delivered flexible circuit board, so The bearings used are all ordinary ball bearings. Due to the large friction of the bearings of this design, it is easy to cause the friction between the flexible circuit board and the bearing rotation and transportation, which will cause the surface of the flexible circuit board to be scratched and cause coating. The case of delamination

[0004] Therefore, the prior art oven has the aforementioned problems and shortcomings in its overall structure for conveying flexible circuit boards, and it needs to be improved.

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