Semiconductor packaging device

A technology for packaging devices and semiconductors, applied in semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as easy access to chips, easy peeling of glue, and poor photosensitive effect of chips, so as to reduce dust-free requirements and reduce light refraction , Improve the photosensitive effect

Pending Publication Date: 2020-05-19
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors of the present application have discovered during long-term research that, on the one hand, since the thickness of the transparent glass cover plate is generally thick, refraction, reflection and energy loss will occur when the light passes through the transparent glass, which will make the photosensitive effect of the chip worse; On the other hand, the transparent glass cover and the chip are connected by glue. After a long time of use, the glue is easy to fall off, and the external dust is easy to enter the photosensitive area of ​​the chip, which will affect the photosensitive effect of the chip.

Method used

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  • Semiconductor packaging device
  • Semiconductor packaging device
  • Semiconductor packaging device

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0031] see figure 1 , figure 1 It is a schematic structural diagram of an embodiment of a semiconductor packaging device of the present application, the semiconductor packaging device 1 includes:

[0032] The chip 10 includes a front side 100 and a back side 102. The front side 100 of the chip 10 is provided with a photosensitive area 104 and pads 106 around the photosensitive area 104; specifically, the chip 10 can be cut from a wafer. The number of pads 10...

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Abstract

The invention discloses a semiconductor packaging device, and the packaging device comprises: a chip which comprises a front surface and a back surface, wherein the front surface of the chip is provided with a photosensitive region and a bonding pad located at the periphery of the photosensitive region; a metal piece which is positioned on one side, back to the chip, of the bonding pad; a transparent protective layer which is located on the front face of the chip and covers the photosensitive area of the chip, wherein the surface of the first end, away from the chip, of the metal piece is exposed out of the transparent protective layer; a circuit board which is positioned on the back surface of the chip; and a conductive connecting piece which is electrically connected with the surface ofthe first end, exposed out of the transparent protective layer, of the metal piece and the circuit board, so that the chip is electrically connected with the circuit board. In this way, the photosensitive effect of the chip can be improved.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a semiconductor chip packaging device. Background technique [0002] A chip with a photosensitive area is a very important part of an imaging device. In order to protect the photosensitive area of ​​the chip, a commonly used packaging method includes: adding a transparent glass cover above the photosensitive area of ​​the chip to protect the photosensitive area of ​​the chip. [0003] The inventors of the present application have discovered during long-term research that, on the one hand, since the thickness of the transparent glass cover plate is generally thick, refraction, reflection and energy loss will occur when the light passes through the transparent glass, which will make the photosensitive effect of the chip worse; On the other hand, the transparent glass cover and the chip are connected by glue. After a long time of use, the glue is easy to fall off, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/1462
Inventor 俞国庆
Owner NANTONG FUJITSU MICROELECTRONICS
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