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Computer device and heat dissipation method thereof

A technology of a computer device and a heat dissipation method, applied in the computer field, can solve the problems of the discount of the heat dissipation capacity of the computer device, the size of the air inlet and the air outlet cannot be too large, etc., to reduce the probability of dust entering the main casing, good heat dissipation effect, and appearance. Complete and beautiful effect

Inactive Publication Date: 2020-05-15
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to prevent the entry and accumulation of dust in traditional computer devices, the size of the air inlet and outlet is usually not too large, but this also compromises the heat dissipation capacity of the computer device

Method used

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  • Computer device and heat dissipation method thereof
  • Computer device and heat dissipation method thereof
  • Computer device and heat dissipation method thereof

Examples

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Embodiment Construction

[0048] In order to make the above-mentioned features and effects of the present invention more clear and understandable, the following specific examples are given together with the accompanying drawings for detailed description as follows.

[0049] figure 1 is a schematic diagram of a computer device according to an embodiment of the present invention. figure 2 yes figure 1 Schematic diagram of the computer device with the lid lifted. see figure 1 and figure 2 , in this embodiment, the computer device 100 is an example of a microcomputer or an ultramicrocomputer, which is close to the size of a human hand. Of course, the type and size of the computer device 100 are not limited thereto. In this embodiment, the computer device 100 includes a main casing 110 and at least one cover 120 . The main casing 110 includes a body 111 having at least one opening 112 . The cover 120 is pivotally connected to the main casing 110 to selectively cover or expose the opening 112 . In ...

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PUM

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Abstract

The invention relates to a computer device. The computer device comprises a main shell, a cover body, a mainboard and an electromagnetic actuator, the body of the main shell is provided with an opening, and the first fixed part of the main shell is pivoted to the body. The cover body is pivoted to the main shell, selectively shields or exposes the opening, and comprises a second fixed part; the mainboard is located in the main shell and comprises a central processing unit and a temperature monitoring chip. The temperature monitoring chip is used for monitoring the temperature of the central processor. The electromagnetic actuator is electrically connected to the mainboard. When the temperature is greater than or equal to a preset value and the electromagnetic actuator receives an indication signal, the electromagnetic actuator pushes against the first fixed part, so that the first fixed part rotates to release the second fixed part, and the electromagnetic actuator is suitable for exposing the cover body out of the opening. The invention further provides a heat dissipation method of the computer device.

Description

technical field [0001] The invention relates to the field of computers, and in particular to a computer device with a lid that can be lifted up and a heat dissipation method thereof. Background technique [0002] Heat dissipation has always been an important issue for computer devices, especially how to make computer devices with high power, high heat dissipation capability and beautiful appearance is a challenge for designers. In order to prevent dust from entering and accumulating in traditional computer devices, the size of the air inlet and outlet is usually not too large, but this also compromises the heat dissipation capability of the computer device. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the object of the present invention is to provide a computer device, when the temperature of the central processing unit is lower than the preset value, the cover covers the opening to achieve the effect of dustproof and complet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F11/30
CPCG06F1/20G06F11/3058
Inventor 陈彦廷傅东程黄振昌
Owner GIGA BYTE TECH CO LTD
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