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MEMS micro loudspeaker, preparation method thereof and electronic equipment

A micro-speaker and piezoelectric technology, which is applied in the field of microelectronics, can solve the problems of MEMS micro-speakers, which are large in size and do not meet the needs of miniaturization.

Active Publication Date: 2020-05-12
SHANDONG GETTOP ACOUSTIC
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Problems solved by technology

However, traditional MEMS micro-speakers often need to integrate more than two independent sounding units to extend the bandwidth range, which makes the overall volume of MEMS micro-speakers too large and does not meet the miniaturization requirements.

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  • MEMS micro loudspeaker, preparation method thereof and electronic equipment
  • MEMS micro loudspeaker, preparation method thereof and electronic equipment
  • MEMS micro loudspeaker, preparation method thereof and electronic equipment

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Embodiment Construction

[0049] In order to make the purpose, technical solutions, and advantages of this application clearer, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the application, but not to limit the application.

[0050] In the description of this application, it should be understood that the terms "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by “bottom”, “inner”, and “outer” are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying the device or The element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood a...

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Abstract

The invention relates to an MEMS micro loudspeaker, a preparation method thereof and electronic equipment. The MEMS micro loudspeaker comprises a supporting structure and a piezoelectric vibrating diaphragm arranged on the supporting structure; a back cavity is formed in the supporting structure so as to expose part of the piezoelectric vibrating diaphragm; the piezoelectric vibrating diaphragm comprises a low-frequency region opposite to the back cavity, the low-frequency region comprises a high-frequency region and a low-frequency sub-region, and the rigidity of the low-frequency sub-regionis smaller than that of the high-frequency region. According to the MEMS micro loudspeaker, the preparation method of the MEMS micro loudspeaker and the electronic equipment, high-frequency-band soundwaves and low-frequency-band sound waves can be simultaneously emitted in the same sound production monomer, so that the bandwidth range is broadened; meanwhile, compared with a traditional mode of integrating a plurality of sound production single bodies, the effective area of the piezoelectric vibrating diaphragm can be increased, and the overall size of the MEMS micro loudspeaker is reduced.

Description

Technical field [0001] The invention relates to the technical field of microelectronics, in particular to a MEMS micro speaker, a preparation method of the MEMS micro speaker, and electronic equipment. Background technique [0002] At present, speakers are gradually developing towards miniaturization. Micro-speakers use MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology to reduce the size of components while achieving the advantage of mass manufacturing, which is welcomed by people. However, the traditional MEMS micro speakers often need to integrate more than two independent sound-producing monomers to extend the bandwidth range, making the overall volume of the MEMS micro speakers too large, which does not meet the miniaturization requirements. Summary of the invention [0003] Based on this, it is necessary to provide a MEMS micro-speaker, a manufacturing method of the MEMS micro-speaker, and electronic equipment in response to the above-mentione...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/02H04R31/00
CPCH04R19/02H04R31/00H04R2201/003H04R2231/003
Inventor 罗松成王逸加方维伦
Owner SHANDONG GETTOP ACOUSTIC
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