Method for realizing low-stress sensitive structure chip mounting process

A sensitive structure, low stress technology, applied in microstructure technology, microstructure devices, processing microstructure devices, etc., can solve the problem of affecting the accuracy index and environmental adaptability of MEMS devices, reducing the long-term reliability and stability of devices, and destroying MEMS. Device packaging atmosphere and other issues, to ensure long-term reliability and stability, low patch stress, and high integration.

Active Publication Date: 2020-05-12
BEIJING AUTOMATION CONTROL EQUIP INST
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Problems solved by technology

[0004] (1) SMD stress problem: For resonant MEMS devices, SMD stress will affect its quality factor and other resonance characteristics, and then affect the accuracy indicators and environmental adaptability of MEMS devices
[0005] (2) The problem of outgassing of the patch adhesive: In general, MEMS devices use the patch adhesive of epoxy resin material, which will more or less release impurity gases such as water vapor
These impurity gases will destroy the packaging atmosphere of MEMS devices and reduce the long-term reliability and stability of the devices

Method used

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  • Method for realizing low-stress sensitive structure chip mounting process
  • Method for realizing low-stress sensitive structure chip mounting process
  • Method for realizing low-stress sensitive structure chip mounting process

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Embodiment Construction

[0030] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit t...

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Abstract

The invention relates to a method for realizing a low-stress sensitive structure chip mounting process, and can solve the technical problems existing in the existing chip mounting mode of the sensitive structure of an MEMS (Micro-electromechanical Systems) device adopting glue such as epoxy resin and the like. The method comprises the following steps: plating a gold layer on the tube shell of theMEMS device; manufacturing a plurality of gold balls which are arranged according to a set layout on the gold layer; plating a gold layer on the mounting surface of the sensitive structure; placing the sensitive structure on the tube shell of the MEMS device, and aligning the gold balls with the gold layer of the mounting surface of the sensitive structure to obtain a composite structure; and applying certain pressure to the sensitive structure in a vacuum and high-temperature environment and realizing the connection of the mounting surface and the gold balls through a gold-gold thermocompression bonding process so as to complete the sensitive structure mounting process.

Description

technical field [0001] The invention relates to the technical field of MEMS device packaging, in particular to a method for realizing a low-stress sensitive structure patching process. Background technique [0002] Sensitive structure mounting technology is one of the key process technologies of MEMS device packaging. The stress of the chip and the outgassing of the glue used in the chip directly affect the long-term stability and environmental adaptability of the MEMS device. At present, epoxy resin is generally used as the patch adhesive, which is easy to choose and easy to operate, and is a widely used patch method. [0003] The main problems of the sensitive structure patching method of MEMS devices using epoxy resin and other glues are as follows: [0004] (1) SMD stress problem: For resonant MEMS devices, SMD stress will affect its quality factor and other resonance characteristics, and then affect the accuracy indicators and environmental adaptability of MEMS devices...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
CPCB81C3/001B81C2203/035Y02P70/50
Inventor 王登顺盛洁苏翼刘韧车一卓唐琼丁凯李海燕
Owner BEIJING AUTOMATION CONTROL EQUIP INST
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