A thermally conductive support and electronic equipment

A technology of heat conduction bracket and heat conduction plate, which is applied in the direction of modification through conduction and heat transfer, TV, color TV, etc. It can solve the problems of internal device damage and the heat of the casing cannot be dissipated in time, so as to reduce the service life and prolong the service life Effect

Inactive Publication Date: 2021-08-31
北京澎思科技有限公司
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Problems solved by technology

[0003] The purpose of the present invention is to provide a heat-conducting support and electronic equipment, through the structural design of the heat-conducting support to solve the technical problem in the prior art that the internal heat of the casing cannot be dissipated in time, resulting in damage to internal devices

Method used

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  • A thermally conductive support and electronic equipment
  • A thermally conductive support and electronic equipment
  • A thermally conductive support and electronic equipment

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Embodiment Construction

[0029] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention relates to a heat conduction bracket and electronic equipment. It includes a heat absorbing plate facing the heat generating device, a heat conducting plate is arranged at the side end of the heat absorbing plate, and a heat transfer medium plate is detachably connected to the heat conducting plate. The object of the present invention is to provide a heat conduction support and electronic equipment. Through the structural design of the heat conduction support, the technical problem existing in the prior art that the internal heat of the casings such as security devices cannot be dissipated in time, resulting in damage to internal devices.

Description

technical field [0001] The invention relates to a heat conduction bracket and electronic equipment. Background technique [0002] The existing security device is equipped with a main board and a power board. When working, the main board and the power board will generate a lot of heat, especially the main chip of the main board has a high heat, and the internal space of the casing is small and the sealing is good, so the heat cannot be dissipated quickly. Excessive heat inside the case may cause damage to the components on the main board or power board, resulting in the failure of the entire security device to work normally and cannot be monitored, resulting in monitoring Loopholes, and increase consumption costs. Contents of the invention [0003] The object of the present invention is to provide a heat conduction support and electronic equipment. Through the structural design of the heat conduction support, the technical problem existing in the prior art that the interna...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H05K7/14H05K7/20
CPCH05K7/2039H05K7/20509H05K7/1422H04N23/50
Inventor 郑玉柱马原韩立通
Owner 北京澎思科技有限公司
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