Semiconductor sub-assembly and semiconductor power module

A technology for power modules and semiconductors, which is applied to semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of difficulty in having a semiconductor power module 200, temperature rise, thin thickness, etc., and achieves omitting spacers, The effect of reducing thickness and omitting wire bond connections

Pending Publication Date: 2020-04-28
HYUNDAI MOTOR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In such a conventional structure, the temperature may rise due to the thermal resistance of the spacer 7, and a space for wiring bonding connection is also required, so it is difficult for the semiconductor power module 200 to have a thinner thickness.

Method used

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  • Semiconductor sub-assembly and semiconductor power module
  • Semiconductor sub-assembly and semiconductor power module
  • Semiconductor sub-assembly and semiconductor power module

Examples

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Embodiment Construction

[0034] It should be understood that the term "vehicle" or "vehicular" or other similar terms as used herein generally includes motor vehicles, such as passenger vehicles including sport utility vehicles (SUVs), vans, trucks, various commercial vehicles, etc. Automobiles, including boats of all kinds, ships, aircraft, etc., and including hybrid vehicles, electric vehicles, plug-in hybrid electric vehicles, hydrogen-powered vehicles, and other alternative fuel vehicles (such as those derived from non-petroleum energy ). As referred to herein, a hybrid vehicle is a vehicle that has two or more sources of power, such as both gasoline-powered and electric-powered vehicles.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will b...

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Abstract

A semiconductor sub-assembly and a semiconductor power module capable of having the reduced thickness of a chip and reduced thermal resistance are provided. The semiconductor sub-assembly includes a single or a plurality of semiconductor chips having a first electrode that is formed on the lower surface thereof, a second electrode that is formed on the upper surface thereof, and a plurality of chip-side signal electrode pads that are formed at one end of the upper surface thereof. The semiconductor chip is embedded in the embedded structure and a plurality of extension signal electrode pads are connected to each of the chip-side signal electrode pads. The extension signal electrode pad is formed on the embedded substrate in a size greater than the chip-side signal electrode pad when viewedon the plane.

Description

technical field [0001] The present invention relates to a semiconductor subassembly and a semiconductor power module, and more particularly, to a semiconductor subassembly capable of minimizing and reducing thermal resistance and a semiconductor power module having the semiconductor subassembly. Background technique [0002] The heat dissipation performance of semiconductor power modules is being improved, and furthermore, there is a trend to reduce mounted semiconductor chips. For example, in a dual-sided cooling package, equivalent cooling performance can be obtained with approximately half the size of a single-sided cooling package. In addition, in silicon carbide (SiC) power devices, which are examples of power semiconductors, it is expected that equivalent performance can be obtained with a chip that is 1 / 5 the size of a conventional chip. Meanwhile, in the double-sided cooling package, a connection structure with signal terminals becomes an obstacle to downsizing. As...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L25/07H01L25/18
CPCH01L23/488H01L25/072H01L25/18H01L23/4924H01L23/5386H01L23/5389H01L23/5385H01L23/3735H01L2224/2518H01L2224/04105H01L2224/04026H01L2224/0603H01L2224/0346H01L2224/06181H01L2224/32225H01L2224/291H01L2224/33181H01L2224/73267H01L24/19H01L24/25H01L24/06H01L24/29H01L24/32H01L24/33H01L24/73H01L2924/181H01L2924/014H01L2924/00014H01L2924/00012H01L25/0655H01L24/46H01L24/14H01L2224/08245H01L24/08
Inventor 日吉道明朴星珉
Owner HYUNDAI MOTOR CO LTD
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