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High-power inductor

A high-power, inductive technology, applied in transformer/inductor housing, transformer/inductor cooling, transformer/inductor coil/winding/connection, etc., can solve the problem of low current resistance, power consumption, magnetic material air gap increase. Large and other problems, to achieve the effect of high current load capacity, lower operating temperature, and stable air gap structure

Pending Publication Date: 2020-04-24
南充新川电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the wire-wound chip power inductor is the product of the miniaturization of the traditional wire-wound power inductor, but its disadvantage is that it is limited in further miniaturization, and the current resistance is low when it is miniaturized.
In addition, in the prior art, the chip power inductor composed of a base, a magnetic core on the base, and two coils on the magnetic core has a relatively complicated structure. In order to facilitate welding of the power inductor on the circuit board, Generally, there are pins on the base, and the pins are mainly set on the bottom surface of the base to form a plug-in structure.
Especially when the size of the power inductor is very small, the production, molding and assembly of the base, magnetic core, coil and pins connecting the coil are inconvenient, and the efficiency of production and assembly is low.
[0004] On the other hand, with the development of switching power supplies, the power requirements continue to increase, and the stored energy of the PFC inductor in the switching power supply is also increasing. This requires the air gap of the magnetic material to also increase, and the resulting high frequency Flux leakage will bombard the enameled wire next to it, generating high temperature, consuming power and reducing efficiency

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0033] Such as Figure 1 to Figure 4 As shown, Embodiment 1 of the present invention proposes a high-power inductor, which includes a first magnetic base 1, a second magnetic base 2, and a "U"-shaped connecting terminal 3, and the first magnetic base 1 is provided with A slot structure for fixing the connection terminal 3. The connecting terminal 3 functions as an induction coil, and its end forms a soldering pin electrically connected to the circuit on the main board of the electronic instrument. The opposite connecting end faces of the second magnetic base 2 and the first magnetic base 1 are connected and fixed by adhesive glue, and an air gap 4 is formed between the opposite connecting end faces, that is, the relative connection between the second magnetic base 2 and the first magnetic base 1 The separation gap between the end faces.

[0034] Further, in the first embodiment, the connecting terminal 3 includes a connecting arm 31 straddling the first magnetic base 1 and b...

Embodiment 2

[0038] Such as Figure 3 to Figure 6 As shown, Embodiment 2 of the present invention proposes a high-power inductor. The high-power inductor includes a first magnetic base 1, a second magnetic base 2, and a "U"-shaped connecting terminal 3. The first magnetic base 1 is provided with A slot structure for fixing the connection terminal 3. The connecting terminal 3 functions as an induction coil, and its end forms a soldering pin electrically connected to the circuit on the main board of the electronic instrument. The opposite connecting end faces of the second magnetic base 2 and the first magnetic base 1 are connected and fixed by adhesive glue, and an air gap 4 is formed between the opposite connecting end faces, that is, the relative connection between the second magnetic base 2 and the first magnetic base 1 The separation gap between the end faces.

[0039] Further, in the second embodiment, the connecting terminal 3 includes a connecting arm 31 straddling the first magnet...

Embodiment 3

[0043] Such as Figure 7 As shown, on the basis of Embodiment 1 and Embodiment 2 of the present invention, the adhesive glue used to bond and fix the opposite connection end surfaces of the second magnetic base 2 and the first magnetic base 1 is on the connection surface of the two One layer of adhesive glue layer 6 is formed at the place. The adhesive layer 6 is mixed with a number of glass bead particles 7 with the same diameter. The diameter of the glass bead particles 7 is adjusted according to the inductance. Glass bead particles 7 with different diameters can make the size of the formed air gap 4 vary. The same, thus determining the size of the inductance. The size of the air gap 4 , that is, the distance between the opposite connecting end surfaces of the second magnetic base 2 and the first magnetic base 1 , is adapted to the diameter of the glass bead particles 7 . Such as Figure 8 As shown, it is a schematic diagram of the cross-sectional structure of the bonding...

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Abstract

The invention discloses a high-power inductor, relates to the field of high-power inductance elements, and solves the problems of low assembly efficiency, low current resistance intensity and low power of an existing winding sheet type power inductor. The high-power inductor comprises a first magnetic base, a second magnetic base and a U-shaped connecting terminal, the first magnetic base is provided with a clamping groove structure used for fixing the connecting terminal, the opposite connecting end faces of the second magnetic base and the first magnetic base are connected through adhesive glue, and an air gap is formed between the opposite connecting end faces of the second magnetic base and the first magnetic base. The high-power inductor is simple in structure. An integrated connecting terminal is adopted, a connecting arm is used for forming a coil of the high-power inductor, and connecting ends are used for forming welding pins electrically connected with a circuit on an electronic element motherboard. Compared with an existing coil type high-power inductor, the high-power inductor has the advantages that structures such as coils and pins are omitted, winding and pin weldingare not needed, forming, production and assembly are more convenient and faster, and meanwhile the high-power inductor has higher current load resistance and lower working temperature.

Description

technical field [0001] The invention relates to the technical field of power inductors, in particular to a high-power inductor with efficient and convenient production and assembly. Background technique [0002] High-power chip inductors generally refer to chip inductors with a current resistance of more than 1A. With the continuous development of electronic technology, electronic components are gradually developing in the direction of high frequency, miniaturization, and power. High-power chip inductors are designed to meet the needs of electronic equipment, especially the electromagnetic compatibility requirements of the power supply. interference. [0003] From the manufacturing process, there are mainly four types of chip power inductors, namely, wire-wound, laminated, braided and film-type chip power inductors. Among them, the wire-wound chip power inductor is the miniaturization product of the traditional wire-wound power inductor, but its disadvantage is that it is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/02H01F27/08H01F27/29
CPCH01F27/02H01F27/08H01F27/29
Inventor 伍尚攀
Owner 南充新川电子科技有限公司
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