A printed circuit substrate with high-precision rectangular positioning micro-grooves and its manufacturing method

Abstract

The invention discloses a printed circuit substrate with high-precision rectangular positioning micro-grooves and a manufacturing method. The printed circuit substrate includes a base material layer and a first copper foil layer and a second copper foil layer arranged on the opposite surface of the base material layer. foil layer; a number of evenly distributed rectangular openings are opened on the first copper foil layer, and the rectangular openings penetrate the first copper foil layer and the substrate layer to the upper surface of the second copper foil layer to form a A rectangular positioning micro-groove for a bare optical fiber; two adjacent rectangular positioning micro-grooves are separated by a ridge, and the ridge is composed of a first copper foil layer and a substrate layer; the side walls of the rectangular positioning micro-groove and the printed The surface of the circuit substrate is vertical. The copper foil of the opening layer of the present invention can block the laser energy and ensure that the side wall of the substrate layer is not ablated during the laser etching process, thereby producing high-precision rectangular positioning microgrooves, ensuring the spacing accuracy of the positioning microgrooves, and improving the bare optical fiber The coupling efficiency of the array to the optoelectronic chip array.

Description

technical field [0001] The invention relates to a printed circuit substrate with high-precision rectangular positioning micro-grooves and a manufacturing method. Background technique [0002] With the rapid increase in the integration level and operating frequency of electronic equipment, the electrical interconnection method based on metal copper can no longer transmit signals efficiently. In the case of high frequency, it will bring serious signal delay and crosstalk, limited bandwidth, and sharp increase in power consumption, which has become a bottleneck for the rapid development of electronic equipment. The optical fiber is embedded in the substrate of the printed circuit board to form a photoelectric interconnection circuit, and the use of optical interconnection instead of electrical interconnection can realize the information transmission between functional units in the electronic equipment system, and can eliminate the technical bottleneck encountered in information...

AI Technical Summary

Problems solved by technology

No matter which of the above methods is adopted, due to the inherent positioning error of mechanical equipment (the cumulative positioning error of a certain type of equipment in the axial direction of the full stroke reaches 20 μm), as the number of bare optical fiber positioning micro-groove channels increases, the cumulative error will increase, and the positioning micro- The accuracy of the groove spacing cannot be guaranteed, the yield rate will drop, and the cost will increase

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