Double-helix stepped forced vortex type liquid cooling radiator and processing method thereof

Abstract

The invention relates to a double-helix stepped forced vortex type liquid cooling radiator and a processing method thereof. The double-helix stepped forced vortex type liquid cooling radiator comprises an upper cover plate, a substrate and a lower cover plate which are sequentially fixed into a whole, wherein at least one of the upper cover plate and the lower cover plate is provided with a double-helix stepped groove, so that cooling liquid flows along a helix path and generates forced vortexes when flowing through the double-helix stepped groove, and one or two double-helix stepped forced vortex type liquid flow channels are formed; a liquid inlet and a liquid outlet are formed in one side of the substrate, and a liquid return flow guide hole which penetrates through the top and the bottom and is communicated with the liquid outlet is further formed in the substrate; flow guide grooves communicated with the liquid flow inlet are formed in the top and the bottom of the substrate, theflow guide grooves are sealed by flow guide groove sealing blocks, and liquid inlet flow guide holes are formed in the flow guide groove sealing blocks. By arranging the multi-layer double-helix stepped forced vortex type liquid flow channel, the heat dissipation area and the vortex effect are effectively enhanced, the temperature rise of the semiconductor device is greatly reduced, and the stability and the reliability of the semiconductor device are improved.

Description

technical field [0001] The invention relates to the technical field of heat sinks, and more specifically relates to a double-helix stepped forced eddy current liquid-cooled heat sink suitable for high-power thyristors and power electronic semiconductor devices and a processing method thereof. Background technique [0002] Power electronic equipment in modern power grids has further improved requirements for reliability, performance indicators, and power density, and the thermal design of power electronic equipment is becoming more and more important. Semiconductor devices are key devices in rail transit and power electronic equipment. The quality of their working status directly affects the reliability, safety and service life of the whole machine. In addition to effectively dissipating heat, the heat dissipation scheme of semiconductor devices also has is also crucial. [0003] Current semiconductor devices will generate conduction and switching losses during operation, so...

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is: to overcome the deficiencies of the prior art, to provide a new generation of double-helix ladder forced eddy current liquid cooling radiator, and to solve the problem that the existing liquid cooling system of rail transit and power electronic equipment cannot adapt The problem of heat generation of semiconductor devices in existing power electronic equipment

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