Heat-conducting silica gel as well as preparation method and application thereof

Abstract

The invention provides heat-conducting silica gel as well as a preparation method and application thereof. The heat-conducting silica gel comprises an adhesive A and an adhesive B according to a massratio of (0.5-1.5): 1; wherein the adhesive A comprises the following components in parts by weight: 100 parts of vinyl silicone oil, 10-30 parts of vinyl MQ silicone resin, 0.5-5 parts of hydrogen-containing silicone oil, 0.1-2 parts of an inhibitor, 300-1500 parts of a heat-conducting filler and 1-10 parts of a coupling agent; the adhesive B is prepared from 100 parts of vinyl silicone oil, 10 to 30 parts of vinyl MQ silicon resin, 1 to 20 parts of a catalyst, 300 to 1500 parts of a heat-conducting filler and 1 to 10 parts of a coupling agent; and the vinyl silicone oil is prepared from vinyl silicone oil with the viscosity of 1 to 2000 cps and vinyl silicone oil with the viscosity of 5000 to 65000cps. The heat-conducting silica gel provided by the invention has good storage stability, and a cured product of the heat-conducting silica gel has relatively high strength and toughness and is easy to integrally peel off.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a heat-conducting silicone gel and its preparation method and application. Background technique [0002] Thermal interface material is a general term for a class of materials that are applied between heat dissipation devices and heat generating devices to reduce the contact thermal resistance between them. Since any surface has a certain roughness, when two surfaces are in contact, there will inevitably be some gaps in them, and the thermal conductivity of air is very small, so it will cause relatively large contact thermal resistance. The use of thermal interface materials can fill this gap, thereby reducing the contact thermal resistance between interfaces and improving heat dissipation performance. [0003] Common thermal interface materials include thermally conductive silicone pads, thermally conductive silicone grease, and thermally conducti...

AI Technical Summary

Problems solved by technology

However, the addition of thixotropic agents such as white carbon black will lead to a rapid increase in the viscosity of the thermally conductive gel system, resulting in difficulty in mixing components A and B and reducing production efficiency

[0006] Moreover, most thermal conductive gels are used on the chip surface of electronic products. After the thermal conductive gel is cured, it is difficult to remove from the chip surface, making it difficult to repair the chip.

Images