Heat dissipation method and electronic equipment

Abstract

The invention provides a heat dissipation method and electronic equipment. For example, the heat dissipation method can be applied to a notebook computer or a tablet computer. The electronic equipmentcomprises a controller, a temperature sensor, a heat conduction assembly, a liquid cooling device and an air cooling device; the liquid cooling device comprises a pump and an annular pipeline; cooling liquid is stored in the annular pipeline, the heating part transmits heat to the cooling liquid, and the pump is used for driving the cooling liquid to circulate; the air cooling device comprises aheat pipe, a fan and a radiator, wherein cooling liquid is stored in the heat pipe, the heating part transmits heat to the cooling liquid, and the radiator is connected with one end of the heat pipe.The method comprises the steps that the controller receives a temperature value, detected by the temperature sensor, of the heating part; when the temperature value is greater than or equal to the temperature threshold value, the controller adjusts the rotating speed of the pump and the rotating speed of the fan through pulse width modulation PWM, so the heat of the heating part is dissipated intothe environment through the annular pipeline and the heat pipe. According to the embodiment of the invention, the medium-low load noise requirement and the high load performance requirement of the electronic equipment can be met.

Description

technical field [0001] The present application relates to the field of electronic equipment, and more particularly, to a heat dissipation method and electronic equipment. Background technique [0002] With the development of notebook computer products towards high performance and thinning, the integration of electronic devices continues to increase, resulting in a sharp increase in the heat flux density of products, and higher and higher requirements for heat dissipation. At the same time, users' demands for products are gradually diversifying. Some users pursue the ultimate performance of notebook computers, which leads to an increase in the power consumption of the central processing unit (CPU) chip, which requires high heat dissipation of the product and needs to improve the heat dissipation capacity of the product; The noise requirements of the computer are high, and the noise of the product needs to be reduced. [0003] At present, the traditional heat dissipation tec...

AI Technical Summary

Problems solved by technology

[0003] At present, the traditional heat dissipation technology for notebook computers is mainly based on the combination of heat pipe modules and fans, which can improve the heat dissipation capacity of the whole machine, but there is a problem of high noise; new fanless notebook computers use heat pipes, vapor chambers, etc. Or phase change heat dissipation technology, which can effectively reduce fan noise, but the heat dissipation capacity is limited

Images