Building backfill adhesive and preparation method thereof

A technology for bonding adhesives and construction, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of large amount of adhesives and increased production costs, so as to improve waterproof and anti-seepage, reduce construction costs, Ease of use

Active Publication Date: 2020-04-10
新田县德润新材料产业园有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The prior art has the following disadvantages: during the backfill operation, a large amount of adhesive is required to completely fill the backfill space, and the amount of adhesive is large, which in turn increases the production cost

Method used

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  • Building backfill adhesive and preparation method thereof
  • Building backfill adhesive and preparation method thereof
  • Building backfill adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A preparation method of building backfill adhesive:

[0043] Specifically include the following steps:

[0044] Step 1: Take the plastic paper and cut it into the required shape, use a heat sealing machine to make a pocket shape, reserve a pocket opening, use a stamping device to press out the glue hole 4 on the pocket, and then paste the sealing film 5 on both sides of the pocket surface, The sealing film 5 seals the glue outlet hole 4, and prepares the adhesive plastic bag body 1 for standby;

[0045] Step 2: Select the expansion extrusion bag body 2 that matches the shape of the adhesive plastic bag body 1 prepared in step one, remove the air inside the expansion extrusion bag body 2, and remove the expansion extrusion bag body 2 from the adhesive plastic bag body Insert the reserved bag opening on the body 1, install and fix the air pipe 6 to form a combination;

[0046] Step 3: The raw materials for preparing adhesive paste 3 are 50 parts of epoxy resin, 24 parts...

Embodiment 2

[0049] A preparation method of building backfill adhesive:

[0050] Specifically include the following steps:

[0051] Step 1: Take the plastic paper and cut it into the required shape, use a heat sealing machine to make a pocket shape, reserve a pocket opening, use a stamping device to press out the glue hole 4 on the pocket, and then paste the sealing film 5 on both sides of the pocket surface, The sealing film 5 seals the glue outlet hole 4, and prepares the adhesive plastic bag body 1 for standby;

[0052] Step 2: Select the expansion extrusion bag body 2 that matches the shape of the adhesive plastic bag body 1 prepared in step one, remove the air inside the expansion extrusion bag body 2, and remove the expansion extrusion bag body 2 from the adhesive plastic bag body Insert the reserved bag opening on the body 1, install and fix the air pipe 6 to form a combination;

[0053] Step 3: The raw materials for preparing adhesive paste 3 are 62 parts of epoxy resin, 27 parts...

Embodiment 3

[0056] A preparation method of building backfill adhesive:

[0057] Specifically include the following steps:

[0058] Step 1: Take the plastic paper and cut it into the required shape, use a heat sealing machine to make a pocket shape, reserve a pocket opening, use a stamping device to press out the glue hole 4 on the pocket, and then paste the sealing film 5 on both sides of the pocket surface, The sealing film 5 seals the glue outlet hole 4, and prepares the adhesive plastic bag body 1 for standby;

[0059] Step 2: Select the expansion extrusion bag body 2 that matches the shape of the adhesive plastic bag body 1 prepared in step one, remove the air inside the expansion extrusion bag body 2, and remove the expansion extrusion bag body 2 from the adhesive plastic bag body Insert the reserved bag opening on the body 1, install and fix the air pipe 6 to form a combination;

[0060] Step 3: The raw materials for preparing adhesive paste 3 are epoxy resin 74, ethylene glycol d...

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PUM

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Abstract

The embodiment of the invention discloses a building backfill adhesive and a preparation method thereof, and concretely relates to the technical field of building materials. The adhesive comprises anadhesive bag body, an expansion extrusion bag body is fixedly arranged in the adhesive bag body, an adhesive paste is filled between the interior of the adhesive bag body and the exterior of the expansion extrusion bag body, a plurality of adhesive outlet holes are evenly formed in the surface of the adhesive bag body, sealing films are pasted on two sides of the surface of the adhesive bag body,and a ventilation pipe is fixedly arranged at one end of the spray extrusion bag body. The adhesive bag body is used for containing the adhesive paste, the bag body is extruded by expansion to extrudethe adhesive paste from the adhesive outlet holes, the expanded expansion extrusion bag occupies the space of the original adhesive paste to support the interior of the adhesive bag body, the adhesive bag body and the adhesive paste backfill the filling position, and the adhesive bag body occupies part of the filling space, so the use amount of the adhesive paste is reduced, and then the construction cost of the adhesive is reduced.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of building materials, in particular to a building backfill adhesive and a preparation method thereof. Background technique [0002] The application of new materials for building objects, buildings are not traditional brick walls, large slab structures, prefabricated slab structures, lightweight material structures, and door and window installations all increase the demand for construction adhesives, especially the demand for adhesives for building backfill decoration more intense. With the improvement of architectural decoration technology, the consumption of construction adhesives has exceeded 400,000 tons, accounting for more than 30% of the total consumption of synthetic adhesives. [0003] The prior art has the following disadvantages: during the backfilling operation, a large amount of adhesive is required to completely fill the backfill space, and the amount of adhesive is l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06
CPCC08L2205/035C08L2205/06C08L2205/16C09J11/06C09J11/08C09J163/00C08L23/06C08L33/02C08L21/00C08K5/1515
Inventor 廖平湘
Owner 新田县德润新材料产业园有限公司
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