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Hot melt adhesive transfer device

A transfer device, hot melt adhesive technology, applied in the direction of packaging, transportation and packaging, transport passenger cars, etc., can solve the problems that the hot melt adhesive cannot be effectively guaranteed not to solidify, the storage effect of the hot melt adhesive is not good enough, and the heating is uneven, etc. Achieve the effect of solving the problem of insufficient heat preservation, avoiding temperature loss, and good heat preservation effect

Inactive Publication Date: 2020-04-07
湖州碧宁生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the transfer device in the prior art can achieve the purpose of temporarily storing the hot melt adhesive, there are still many shortcomings in actual use, such as the uneven heat supply of the transfer device in the prior art, which cannot effectively ensure the heat in the device. The melt glue does not solidify, so that the storage effect of the transfer device in the prior art is not good enough for the hot melt glue, resulting in poor actual use effect

Method used

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] as attached Figure 1-4 As shown, the present invention provides a hot melt adhesive transfer device, including a transfer tank 1, a storage chamber 17 is provided inside the transfer tank 1, a heating mechanism 2 is provided inside the storage chamber 17, and the transfer tank 1 The bottom of the body 1 is provided with a discharge port 4, and the top of the transfer tank 1 is provided with a feed port 5;

[0023] The heating mechanism 2 includes a mo...

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Abstract

The invention discloses a transfer tank body. The transfer tank body is internally provided with a storage cavity, the storage cavity is internally provided with a heating mechanism, the bottom of thetransfer tank body is provided with a discharging port, and the top of the transfer tank body is provided with a feeding port; the heating mechanism comprises a motor, a rotating shaft is arranged onan output shaft of the motor and is in transmission connection with the output shaft of the motor, an airflow guide block is welded to the top end of the rotating shaft, and an air outlet pipe is arranged at the bottom of the airflow guide block. As the heating mechanism is arranged, the device can uniformly supply heat to the hot melt adhesive in the storage cavity, the situation that the hot melt adhesive is solidified is effectively avoided, the hot melt adhesive storage effect is good, the actual use effect is good, and the practicability is thus high.

Description

technical field [0001] The invention relates to the technical field of transfer devices, and more specifically, the invention relates to a transfer device for hot melt adhesives. Background technique [0002] Hot melt adhesive is a kind of plastic adhesive. Its production process is very simple, and its bonding strength is high and fast. Therefore, its application range is very wide. In the prior art, if too much hot melt adhesive is produced at one time, it cannot be used. After temporary storage is required, a transfer device is needed, which can store hot melt adhesive for a certain period of time to avoid its rapid solidification. [0003] Although the transfer device in the prior art can achieve the purpose of temporarily storing the hot melt adhesive, there are still many shortcomings in actual use, such as the uneven heat supply of the transfer device in the prior art, which cannot effectively ensure the heat in the device. The melt glue does not solidify, so that th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D88/74B65D90/00
CPCB65D88/744B65D90/00
Inventor 朱亦韩
Owner 湖州碧宁生物科技有限公司
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