A glue dispensing subsequent glue removal device for electronic components

Abstract

The invention relates to a processing device for electronic components, and discloses a glue dispensing and subsequent glue removal device for electronic components, which includes a fixed bottom plate, a support frame is installed on both sides of the upper end of the fixed bottom plate, a fixed rack is installed on the top of the support frame, and the support frame The guide column is installed between the upper ends, the middle part of the guide column is slidably connected with the sliding block, the bearing seat is installed inside the sliding block, the rotating shaft is installed inside the bearing seat, the movable gear meshing with the fixed rack is installed on the upper end of the rotating shaft, and the bottom end of the rotating shaft is installed Rubber grinding wheel, the air-inducing box is installed in the middle of the left end of the support frame on the right side, the piston plate is installed in the air-inducing box, the air-inducing rod is installed on the left side of the piston plate, the sliding block is connected to the left side of the air-inducing rod, and the lifting is installed between the inner sides of the supporting frame. plate, positioning and clamping mechanisms are installed on both sides of the upper end of the lifting plate. The present invention realizes the reciprocating rotation of the glue removal grinding wheel, greatly increases the glue removal efficiency of electronic components, and at the same time makes the glue residue after glue removal can be better blown away, further increasing the glue removal efficiency.

Description

technical field [0001] The invention relates to a processing device for electronic components, in particular to a glue dispensing and subsequent glue removal device for electronic components. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for hairsprings, springs and other sub-devices, such as diodes are common. [0003] Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors , electronic transformers, ...

AI Technical Summary

Problems solved by technology

[0004] Dispensing electronic components can play the role of moisture-proof, dust-proof, anti-corrosion, shockproof, and improve the performance and stability parameters, but the glue is easy to fly out during the dispensing process, so that the glue sticks to the workbench and solidified on the workbench, which may affect the operation of people using the workbench for dispensing, affect the performance of electronic components, and make the workbench inconvenient to use

Chinese patent (notification number: CN206854007U) discloses a workbench scraping device for dispensing electronic components, including side plates, top plates, geared motors, rotating shafts, gears, bearing seats, racks, poles, handles, sliders, etc. Rail, slide block, connecting rod, first cylinder, swing rod and scraper, the upper part of the side plate has a through hole, the top left side of the side plate is connected with the top plate by bolt connection, and the top of the top plate is connected by bolt connection. The handle and the right side of the bottom of the top plate are connected with a geared motor through a bolt connection, and the output shaft of the geared motor is connected with a rotating shaft through a coupling. Although this device can remove the glue on the electronic components after dispensing to a certain extent, However, in actual operation, the glue cannot be effectively removed, and there will still be a large amount of residue left on the electronic components. Therefore, further improvement is still needed.

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