Hot pressing soldering circuit board and manufacturing method thereof

Abstract

A method for manufacturing a circuit board by hot pressing and melting soldering, which includes the following steps: providing a semi-finished product of a flexible circuit board, the semi-finished product of the flexible circuit board includes a first base layer, a first conductive circuit layer and a second copper layer, The first electroplating layer outside the second copper layer, the first conductive circuit layer is electrically connected to the second copper layer; etching the first electroplating layer to obtain at least one step layer; etching the second copper layer to form a second conductive circuit layer to obtain a flexible circuit plate, at least one pad is etched on the second conductive circuit layer relative to at least one step layer, the size of the pad is larger than the size of the step layer to leave space for overflowing tin on both sides of the pad; tin is printed on the step layer paste; and attach the flexible circuit board to another circuit board, and reflow soldering by pulse heating, so that the solder paste is melted and cooled to form a welding layer on the step layer and the welding pad, and the flexible circuit board is fixed and guided to another circuit board. Pass. The invention also provides a circuit board welded by hot pressing and melting tin.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a hot-pressing soldering soldering circuit board and a manufacturing method thereof. Background technique [0002] In recent years, electronic products are widely used in daily work and life, and the demand for miniaturization, multi-function and high performance is getting higher and higher. The density and precision of the board-to-board connection are getting higher and higher. At present, the connection between the board and the board is carried out by the stacking method of hot-press melting tin welding. The principle of hot-press melting soldering is to print the solder paste on the pad of the circuit board first, melt the solder paste and pre-solder it on the circuit board after going through the reflow oven, and then place the object to be soldered on the solder paste already printed Then use the heat of the thermal head to melt the solder and connec...

AI Technical Summary

Problems solved by technology

However, the currently used stacking design method of hot-press melting soldering is increasingly showing its limitations. For example, during hot-press melting soldering, the solder paste must overflow to both sides of the pad. When the pad spacing is reduced, the pad The risk of short circuit between them is increased, which limits the reduction of the pad pitch of thermocompression soldering

Images