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A kind of bottom filling glue filling method

A technology of bottom filling glue and filling method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems affecting the reliability of packaging, etc., and achieve the effects of improving service life, improving thermal conductivity, and increasing movement speed

Active Publication Date: 2021-11-23
SHANGHAI XIANFANG SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of filling the underfill into the gap between the chip and the organic substrate, the flow rate of the underfill under the chip has been considered to be the bottleneck of mass production in the underfill process, and the flow process will directly affect the reliability of the package. sex

Method used

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  • A kind of bottom filling glue filling method
  • A kind of bottom filling glue filling method
  • A kind of bottom filling glue filling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a method for filling an underfill, including:

[0041] Add magnetic material to the underfill to form a composite filler 3, which is placed on one side of the chip 1, and the composite filler fills the gap between the substrate and the chip;

[0042] During the filling process, a magnet 4 is placed under the substrate 5 of the electronic packaging device and on the same side of the chip, and the magnet performs a circular movement in the area corresponding to the gap to be filled, and the trajectory is shown in figure 1 , the moving speed of the magnet is 0.5m / s, the magnet drives the magnetic material to move, and then drives the composite filler to flow to the other side of the chip, and fills the gap between the substrate and the chip to complete the filling process;

[0043] At 30°C, a filled electronic packaging device is formed after heating and curing;

[0044] Among them, the composite filler includes bisphenol A epoxy resin and magneti...

Embodiment 2

[0046] This embodiment provides a method for filling an underfill, including:

[0047] Add magnetic material to the underfill to form a composite filler 3, which is placed on one side of the chip 1, and the composite filler fills the gap between the substrate and the chip;

[0048] During the filling process, a magnet 4 is placed under the substrate 5 of the electronic packaging device and on the same side of the chip, and the magnet performs a circular circular motion in the area corresponding to the filled gap, and the movement track of the magnet is shown in figure 2As shown in middle b, the rotation speed of the magnet is 10 μm / s, and the diameter of the circular motion is 30 mm in length of the substrate. The magnet drives the magnetic material to move, and then drives the composite filling glue to flow to the other side of the chip, and the contact between the substrate and the chip is controlled. The gap is filled to complete the filling process;

[0049] At 100°C, af...

Embodiment 3

[0052] This embodiment provides a method for filling an underfill, including:

[0053] Add magnetic material to the underfill to form a composite filler 3, which is placed on one side of the chip 1, and the composite filler fills the gap between the substrate and the chip;

[0054] During the filling process, a magnet 4 is placed under the substrate 5 of the electronic packaging device and on the same side of the chip, and the magnet performs circular motion and centrifugal motion in the area corresponding to the filled gap, and the trajectory is shown in image 3 As shown in middle b, the speed of the circular motion of the magnet is 13 μm / s, and the speed of the centrifugal motion is 3 μm / s. The magnet starts to perform centrifugal motion and circular motion at the center of the substrate, and stops the centrifugal motion when the magnet moves centrifugally to the edge of the substrate. But keep doing the circular motion until the compound filler is completely filled. The m...

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Abstract

The invention belongs to the technical field of semiconductor packaging, and in particular relates to a method for filling an underfill glue. The method includes adding a magnetic material to the bottom filler to form a composite filler; during the filling process, an external magnetic field drives the magnetic material and then drives the composite filler to complete the filling process; the method drives the magnetic material by an external magnetic field, and can give The continuous attraction of the underfill greatly increases the movement speed of the underfill, reduces the problem of incomplete filling of large-size chips, greatly shortens the filling time, and improves production efficiency.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a method for filling an underfill glue. Background technique [0002] With the rapid development of the electronic components industry, which is the basis of the electronic information industry, the miniaturization and high integration of electronic products has become a development trend. With the development trend of miniaturization, portability and functional diversification of electronic products, the package spacing of chip packages in electronic products is becoming smaller and smaller. Due to the small welding height, the shear force caused by mechanical stress makes the chip package It is very easy to break; at the same time, the coefficient of thermal expansion between the chip and the substrate, and between the substrate and the substrate is inconsistent, which will cause the solder joints to fall off or break when the chip is working, which ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L21/67
CPCH01L21/56H01L21/67121H01L2224/16225
Inventor 陈立军徐友志曹立强
Owner SHANGHAI XIANFANG SEMICON CO LTD
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