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A kind of underfill with high surface insulation resistance and preparation method thereof

An underfill and insulation resistance technology, applied in the field of underfill with high surface insulation resistance and its preparation, can solve the problems of low surface insulation resistance, poor high temperature adhesion, poor high and low temperature resistance, etc., and achieve vitrification High transition temperature, high surface insulation resistance, good high and low temperature resistance

Active Publication Date: 2022-05-13
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Microelectronics packaging technology is developing in the direction of high density and multiple I / O pins. In common BGA and CSP microelectronics packaging technologies, the pitch of solder balls is generally 0.8mm, the distance between pins is short, and moisture absorption after packaging It will reduce the service life of the components, make the electrical parameters of the components worse, and cause the components to open and fail
After moisture absorption, the surface insulation resistance decreases, and it is also easy to cause short circuit and failure of components
Underfill is widely used in packaging technology. Epoxy resin is usually used as the main raw material for underfill. This is a thermosetting resin. After curing, it has the advantages of good adhesion, good dimensional stability, and high mechanical strength. High and low temperature performance is poor, and moisture resistance is poor, which leads to most underfills having shortcomings such as high low temperature brittleness, poor high temperature adhesion, poor moisture resistance, and low surface insulation resistance after moisture absorption, which cannot meet the needs of microelectronics. Requirements for high packaging density, good electrical performance, and high reliability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An underfill with high surface insulation resistance, the components of which include: bisphenol F epoxy resin EXA-830LVP 620g, dicyclopentadiene phenol type epoxy resin HP-7200 50g, polydimethylsiloxane 8 g of oxane compound, 6 g of γ-glycidyl etheroxypropyl trimethoxysilane, 6 g of carbon black, and 310 g of dihydrazine compound VDH-J.

[0027] The preparation method of the above-mentioned underfill with high surface insulation resistance is as follows:

[0028] (1) Weigh 620g of bisphenol F epoxy resin EXA-830LVP, 50g of dicyclopentadiene phenol type epoxy resin HP-720000 and 6g of carbon black, put them into the reaction kettle and heat up to 90°C, stir at high speed for 1h, and mix well;

[0029] (2) At 30°C, weigh 8 g of polydimethylsiloxane compound and 6 g of γ-glycidyl etheroxypropyl trimethoxysilane, put them into the reaction kettle and stir at high speed for 1.5 h, and mix well;

[0030] (3) Under the condition of 22°C, weigh 310g of the dihydrazine compoun...

Embodiment 2

[0033] An underfill with high surface insulation resistance, the components of which include: bisphenol F epoxy resin EXA-835LV 600g, biphenylphenol type epoxy resin NC-3000 60g, polydimethylsiloxane Compound 8g, γ-glycidyl etheroxypropyltrimethoxysilane 6g, carbon black 6g, dihydrazine compound VDH-J 200g and dihydrazine compound UDH-J 120g.

[0034] The preparation method of the above-mentioned underfill with high surface insulation resistance is as follows:

[0035] (1) Weigh 600g of bisphenol F epoxy resin EXA-835LV, 60g of bisphenol type epoxy resin NC-3000 and 6g of carbon black, put them into the reaction kettle and heat up to 95°C, stir at high speed for 1h, and mix well;

[0036] (2) Under the condition of 35°C, weigh 8g of polydimethylsiloxane compound and 6g of γ-glycidyl etheroxypropyl trimethoxysilane, put them into the reaction kettle and stir at high speed for 1h, and mix well;

[0037] (3) At 24°C, weigh 200g of dihydrazine compound VDH-J and 120g of dihydrazi...

Embodiment 3

[0040] An underfill with high surface insulation resistance, the components of which include: bisphenol F epoxy resin EXA-830LVP 620g, biphenol type epoxy resin NC-3000 40g, polydimethylsiloxane Compound 8g, γ-glycidyl etheroxypropyltrimethoxysilane 6g, carbon black 6g, dihydrazine compound VDH-J 160g, and dihydrazine compound UDH-J 160g.

[0041] The preparation method of the above-mentioned underfill with high surface insulation resistance is as follows:

[0042] (1) Weigh 620g of bisphenol F epoxy resin EXA-830LVP, 40g of bisphenol-type epoxy resin NC-3000 and 6g of carbon black, put them into the reaction kettle and heat up to 98°C, stir at high speed for 0.8h, and mix well;

[0043] (2) At 25°C, weigh 8 g of polydimethylsiloxane compound and 6 g of γ-glycidyl etheroxypropyl trimethoxysilane, put them into the reaction kettle and stir at high speed for 1 hour, and mix well;

[0044] (3) At 24°C, weigh 160g of the dihydrazine compound VDH-J and 160g of the dihydrazine comp...

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PUM

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Abstract

The invention belongs to the technical field of filling glue preparation, in particular to an underfill glue with high surface insulation resistance and a preparation method thereof. The underfill of the present invention does not use any kind of toughening agent or plasticizer, and has low storage modulus, high glass transition temperature, low hygroscopicity, good high and low temperature resistance, and can be used under high temperature and high humidity conditions. The characteristics of high surface insulation resistance ensure the long-term reliable use of micro-sized densely packaged components in various environments.

Description

technical field [0001] The invention belongs to the technical field of filling glue preparation, in particular to an underfill glue with high surface insulation resistance and a preparation method thereof. Background technique [0002] With the advent of the era of electronic information technology, electronic products are required to have the characteristics of multi-functionality, lightness and miniaturization. Microelectronics packaging technology is developing in the direction of high density and multiple I / O pins. In common BGA and CSP microelectronics packaging technologies, the pitch of solder balls is generally 0.8mm, the distance between pins is short, and moisture absorption after packaging It will reduce the service life of the components, make the electrical parameters of the components worse, and cause the components to open and fail. After moisture absorption, the surface insulation resistance decreases, and it is also easy to cause short circuit and failure o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L83/04C08K3/04C08K5/5435C08G59/40
CPCC08L63/00C08G59/4035C08L2205/025C08L83/04C08K3/04C08K5/5435
Inventor 闫善涛陈田安王建斌
Owner YANTAI DARBOND TECH
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