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Semi-automatic stamping system

A semi-automatic, punching machine technology, applied in the field of stamping processing, can solve the problems of complex structure, low firmness, material stripping, etc., and achieve the effect of improving stamping processing efficiency, continuous automatic operation, and avoiding material falling off.

Pending Publication Date: 2019-12-20
ZHUHAI FENGGU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the prior application has many parts and complex structure, which is not conducive to maintenance, and the material transfer unit uses a suction cup to absorb the material for material transfer. For smaller materials, due to the limited adsorption area, the suction cup is used. The firmness of the suction sheet is not high, and it is easy to shift and fall off during the material transfer process, so this method is not suitable for products with small volume

Method used

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Examples

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Embodiment Construction

[0043] see figure 1 , figure 1 It is a structural diagram of an embodiment of the present invention. The semi-automatic punching system includes a feeding unit 1, a punching unit 2 and a control unit. The feeding unit 1 supplies the blanks to the punching unit 2. The punching unit 2 punches the blanks. The control unit controls the feeding unit 1 to perform the feeding action and control The punching unit 2 executes the punching action, and the control unit is preferably a PLC controller.

[0044] see figure 2 , figure 2 It is a structural diagram of an embodiment of the feeding unit of the present invention. The feeding unit 1 comprises a feeding base 11, a sheet finishing platform 12, a blanking assembly 13 and a feeding platform 14, and the blank finishing platform 12, the blanking assembly 13 and the loading platform 14 are all arranged on the feeding base 11, The height of the sheet sorting platform 12 is higher than that of the loading platform 14 , and the unload...

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Abstract

The invention provides a semi-automatic stamping system. The system comprises a feeding unit, a stamping unit and a control unit. The control unit is connected with the feeding unit and the stamping unit. The feeding unit comprises a discharging assembly, a pushing assembly and a loading platform. The discharging assembly is arranged on one side of the loading platform, the pushing assembly is arranged on the loading platform, the discharging assembly carries out discharging in the direction of the pushing assembly in a vibration manner, the pushing assembly is used for pushing materials to the direction of the stamping unit, the stamping unit comprises a stamping machine, a stamping mold, a blowing assembly and a material piece collecting assembly, a mold cavity is formed in the stampingmold in a penetrating manner, a puncher pin on the stamping machine is arranged over the mold cavity, the material piece collecting assembly is arranged below the mold cavity, and the blowing assemblyis arranged on the stamping mold. The stamping production efficiency and the loading stability can be obviously improved.

Description

technical field [0001] The invention relates to the technical field of stamping processing, in particular to a semi-automatic stamping system for metal sheet processing. Background technique [0002] Some high-power RF electronic components on the printed circuit board (PCB) generate a lot of heat. In order to effectively solve the problem of heat dissipation, copper or aluminum with high thermal conductivity is usually embedded in the PCB by sol bonding. Heat sinks help to dissipate heat from RF electronics. [0003] Heat sinks that require large quantities are generally processed by stamping. However, conventional copper or aluminum is a soft material with strong plasticity. After punching, the edge of the blank is squeezed, and the periphery will form a serious arc. sag edge. In addition, because the heat sink is thicker, a larger punching force will be generated during stamping, so the side wall of the heat sink will form a larger area of ​​fracture cracks. This surfa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D28/02B21D28/14B21D43/02B21D43/04B21D43/22B08B5/02B21C51/00
CPCB08B5/02B21C51/00B21D28/02B21D28/14B21D43/02B21D43/04B21D43/22
Inventor 于顺亮杨亦斌于平夏建林
Owner ZHUHAI FENGGU ELECTRONICS TECH CO LTD
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