Manufacturing method of PTFE ceramic modified substrate film for high-performance circuit board

A manufacturing method and circuit board technology, applied in the field of polytetrafluoroethylene production, can solve the problems of low resilience, low water absorption, unadjustable dielectric constant, etc., and achieve the effect of increasing strength and low water absorption

Inactive Publication Date: 2019-12-13
TIANJIN TIANSUBINHAI PTFE PLASTIC PROD
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

PTFE material itself has good high and low temperature resistance, chemical stability, low water absorption, low resilience, and electrical properties, but the dielectric constant cannot be adjusted, the strength is low, and the elongation is high. In order to overcome these shortcomings, The present invention uses the ceramic modified PTFE suspension resin to obtain the substrate film and can be used for high-performance circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A method for manufacturing a PTFE ceramic modified substrate film for a high-performance circuit board, comprising the steps of:

[0023] Step A, the polytetrafluoroethylene suspension resin and the ceramic powder are blended in a blender at a weight ratio of 100:10, and the blending time is 2 minutes to make a mixed batch;

[0024] Step B, put the above-mentioned mixed ingredients in the cavity composed of outer mold, upper mold, lower mold and center core, then pressurize to a unit pressure of 15Mpa at a pressurization speed of 20mm / min, and keep the pressure for 30 minutes to complete Press molding, release the pressure, and release the mold to obtain a molding blank; the outer diameter of the molding blank is 230mm, and the length is 200mm.

[0025] Step C, putting the molded blank into a sintering furnace for sintering according to the sintering curve to obtain a sintered blank with strength;

[0026] The sintering curve consists of three stages: heating, holding ...

Embodiment 2

[0030] A method for manufacturing a PTFE ceramic modified substrate film for a high-performance circuit board, comprising the steps of:

[0031] Step A, polytetrafluoroethylene suspension resin and ceramic powder are blended in a blender with a weight ratio of 100:20, and the blending time is 3 minutes to make a mixed batch;

[0032] Step B, put the above-mentioned mixed ingredients in the cavity composed of outer mold, upper mold, lower mold and center core, then pressurize to a unit pressure of 15Mpa at a pressurization speed of 15mm / min, and keep the pressure for 30 minutes to complete Press molding, release the pressure, and release the mold to obtain a molding blank; the outer diameter of the molding blank is 350 mm, and the length is 500 mm.

[0033] Step C, putting the molded blank into a sintering furnace for sintering according to the sintering curve to obtain a sintered blank with strength;

[0034] The sintering curve consists of three stages: heating, holding and ...

Embodiment 3

[0038] A method for manufacturing a PTFE ceramic modified substrate film for a high-performance circuit board, comprising the steps of:

[0039] Step A, polytetrafluoroethylene suspension resin and ceramic powder are blended in a blender with a weight ratio of 100:60, and the blending time is 5 minutes to make a mixed batch;

[0040] Step B, put the above-mentioned mixed ingredients in the cavity consisting of the outer mold, upper mold, lower mold and center core, then pressurize to a unit pressure of 30Mpa at a pressurization speed of 40mm / min, and keep the pressure for 100 minutes to complete Press molding, release the pressure, and release the mold to obtain a molding blank; the outer diameter of the molding blank is 900 mm, and the length is 1500 mm.

[0041] Step C, putting the molded blank into a sintering furnace for sintering according to the sintering curve to obtain a sintered blank with strength;

[0042] The sintering curve consists of three stages: heating, hold...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
lengthaaaaaaaaaa
lengthaaaaaaaaaa
Login to view more

Abstract

The invention provides a manufacturing method of a PTFE ceramic modified substrate film for a high-performance circuit board. The PTFE ceramic modified base material film for the high-performance circuit board is prepared by mixing a polytetrafluoroethylene suspension resin with a ceramic powder according to a weight ratio of 100:(1-60), and then carrying out mold pressing, sintering and turning on the obtained mixture. The PTFE ceramic modified substrate film has the advantages of aging resistance, high and low temperature resistance, corrosion resistance, low water absorption, dielectric stability and the like of a PTFE material, and ceramic modification can adjust the dielectric constant, reduce or maintain low dielectric loss and increase the strength. The PTFE ceramic modified substrate film has a low DK value and a low DF value or a high DK value and a low DF value, required by the high-performance circuit board substrate under high-frequency and low-wavelength conditions, such as Sub6 and millimeter waves.

Description

technical field [0001] The invention belongs to the technical field of polytetrafluoroethylene production, in particular to a method for manufacturing a PTFE ceramic modified substrate film used for high-performance circuit boards. Background technique [0002] Due to the arrival of 5G, high-performance circuit boards urgently need materials that can be used at high frequencies and low wavelengths. This material needs to have high dielectric constant and low dielectric loss or low dielectric constant and low dielectric At the same time, it must have good high and low temperature resistance and chemical stability, low water absorption, low resilience, good mechanical strength and low elongation. PTFE material itself has good high and low temperature resistance, chemical stability, low water absorption, low resilience, and electrical properties, but the dielectric constant cannot be adjusted, the strength is low, and the elongation is high. In order to overcome these shortcomi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K3/00C08J5/18
CPCC08J5/18C08J2327/18C08K3/00
Inventor 贺万一
Owner TIANJIN TIANSUBINHAI PTFE PLASTIC PROD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap