Manufacturing method of PTFE ceramic modified substrate film for high-performance circuit board
A manufacturing method and circuit board technology, applied in the field of polytetrafluoroethylene production, can solve the problems of low resilience, low water absorption, unadjustable dielectric constant, etc., and achieve the effect of increasing strength and low water absorption
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Embodiment 1
[0022] A method for manufacturing a PTFE ceramic modified substrate film for a high-performance circuit board, comprising the steps of:
[0023] Step A, the polytetrafluoroethylene suspension resin and the ceramic powder are blended in a blender at a weight ratio of 100:10, and the blending time is 2 minutes to make a mixed batch;
[0024] Step B, put the above-mentioned mixed ingredients in the cavity composed of outer mold, upper mold, lower mold and center core, then pressurize to a unit pressure of 15Mpa at a pressurization speed of 20mm / min, and keep the pressure for 30 minutes to complete Press molding, release the pressure, and release the mold to obtain a molding blank; the outer diameter of the molding blank is 230mm, and the length is 200mm.
[0025] Step C, putting the molded blank into a sintering furnace for sintering according to the sintering curve to obtain a sintered blank with strength;
[0026] The sintering curve consists of three stages: heating, holding ...
Embodiment 2
[0030] A method for manufacturing a PTFE ceramic modified substrate film for a high-performance circuit board, comprising the steps of:
[0031] Step A, polytetrafluoroethylene suspension resin and ceramic powder are blended in a blender with a weight ratio of 100:20, and the blending time is 3 minutes to make a mixed batch;
[0032] Step B, put the above-mentioned mixed ingredients in the cavity composed of outer mold, upper mold, lower mold and center core, then pressurize to a unit pressure of 15Mpa at a pressurization speed of 15mm / min, and keep the pressure for 30 minutes to complete Press molding, release the pressure, and release the mold to obtain a molding blank; the outer diameter of the molding blank is 350 mm, and the length is 500 mm.
[0033] Step C, putting the molded blank into a sintering furnace for sintering according to the sintering curve to obtain a sintered blank with strength;
[0034] The sintering curve consists of three stages: heating, holding and ...
Embodiment 3
[0038] A method for manufacturing a PTFE ceramic modified substrate film for a high-performance circuit board, comprising the steps of:
[0039] Step A, polytetrafluoroethylene suspension resin and ceramic powder are blended in a blender with a weight ratio of 100:60, and the blending time is 5 minutes to make a mixed batch;
[0040] Step B, put the above-mentioned mixed ingredients in the cavity consisting of the outer mold, upper mold, lower mold and center core, then pressurize to a unit pressure of 30Mpa at a pressurization speed of 40mm / min, and keep the pressure for 100 minutes to complete Press molding, release the pressure, and release the mold to obtain a molding blank; the outer diameter of the molding blank is 900 mm, and the length is 1500 mm.
[0041] Step C, putting the molded blank into a sintering furnace for sintering according to the sintering curve to obtain a sintered blank with strength;
[0042] The sintering curve consists of three stages: heating, hold...
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