Crystal rod outer diameter grinding equipment for semiconductor devices

Abstract

The invention relates to crystal rod outer diameter grinding equipment for semiconductor devices. The equipment comprises a worktable, a mounting frame, a support mechanism and a grinding mechanism; the support mechanism is mounted at the upper end of the worktable; the mounting frame is arranged at the upper end of the support mechanism; the grinding mechanism is mounted at the lower end of the mounting frame, and comprises a driving motor, a driving gear, a driven gear, a connecting plate and a grinding support chain; the support mechanism comprises a butt joint branch chain, a slide block,a pressing plate, a fixed plate, an extension plate, a support branch chain and an electric slide block; and the grinding support chain comprises a working plate, an adjusting rod, a transverse plate,an adjusting bolt and a grinding plate. Through cooperation of the support mechanism and the grinding mechanism during working, the equipment achieves the purpose of alternately clamping the left andright ends of crystal rods, so that the overall grinding work of the crystal rods is once finished, the operation steps are reduced, the grinding precision is improved, the clamping of the crystal rods by a manual mode is not needed, and the centering precision is improved.

Description

technical field [0001] The invention relates to the field of crystal rod processing, in particular to a crystal rod outer diameter grinding device for semiconductor components. Background technique [0002] Wafer is the basic raw material required for semiconductor components. Wafer production includes two steps: ingot manufacturing and wafer manufacturing. Ingot is the raw material for making chips. During the growth process of the ingot, the outer diameter and roundness have certain deviations, and the outer cylindrical surface is also uneven, so the outer diameter must be trimmed and ground to make the size and shape errors less than the allowable deviation. In the actual grinding process, there are the following problems: [0003] (1) Before grinding the crystal ingot, it is necessary to use a special fixture to clamp the two ends of the crystal ingot, and then use rolling to grind the outer wall of the crystal ingot. Since most of the fixtures currently used are mostly...

AI Technical Summary

Problems solved by technology

[0003] (1) Before grinding the crystal ingot, it is necessary to use a special fixture to clamp the two ends of the crystal ingot, and then use rolling to grind the outer wall of the crystal ingot. Since most of the fixtures currently used are mostly manual clamping, the clamping It is difficult to ensure the alignment accuracy between the clamp and the ingot when it is tight. Once the clamping position deviates greatly, it will make it difficult for the roller mill to grind the surface of the ingot evenly, so that the shape of the ingot after grinding cannot meet the work needs;

[0004] (2) When using a jig to clamp the crystal ingot, since the two ends of the ingot are blocked by the jig, the roller mill cannot fully grind the ingot at one time, and it is necessary to wait for the middle of the ingot to be ground before another crystal ingot Grinding at both ends will easily cause the accumulation of errors during the movement of the ingot, which will further affect the grinding accuracy

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