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Semiconductor assembly and direct-current circuit breaker

A technology of semiconductors and components, applied in the field of semiconductor components and DC circuit breakers, can solve the problems of insufficient compact structure of semiconductor units, and achieve the effects of increasing power integration density, reducing inductance, and high integration

Pending Publication Date: 2019-12-03
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a semiconductor component and a DC circuit breaker to solve the problem that the structure of the semiconductor unit is not compact enough and it is difficult to apply it in a miniaturized high-voltage DC circuit breaker

Method used

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  • Semiconductor assembly and direct-current circuit breaker
  • Semiconductor assembly and direct-current circuit breaker
  • Semiconductor assembly and direct-current circuit breaker

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Embodiment Construction

[0029] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise clearly specified and limited. For example, they can be fixed or detachable. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of the two components, which can be a w...

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Abstract

The invention provides a semiconductor assembly and a direct-current circuit breaker. The semiconductor assembly comprises a capacitor bank, an IGBT press-fitting unit and at least one diode press-fitting unit. Through the layout mode of the capacitor bank, the IGBT press-fitting unit and the diode press-fitting unit, a gap between the capacitor bank and the IGBT press-fitting unit can be effectively utilized, so that the structure of the semiconductor assembly provided by the embodiment of the invention is more compact; the length of a connecting wire between the diode press-fitting unit andthe capacitor bank is shortened, so that the inductance in a loop is reduced, and the safety of a device is guaranteed; in addition, due to the layout mode, the distance between the capacitor bank andthe diode press-fitting unit is the shortest, and the problem of voltage overshoot in the internal current transfer process of the semiconductor assembly is avoided; and application in a miniaturizeddirect-current circuit breaker is facilitated. And the semiconductor assembly can also be used as a semiconductor unit capable of realizing long-term continuous through-current and realizing large-current bidirectional turn-off, and is independently applied to a common direct-current power grid device.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a semiconductor component and a DC circuit breaker. Background technique [0002] The high-voltage DC circuit breaker is an important device in the DC power grid. When the high-voltage DC circuit breaker is in normal conduction state, its long-term current-passing branch, the main branch, is used to bear the rated current of the system, which is to ensure the normal operation of the high-voltage DC circuit breaker The most important part. The main branch of a high-voltage DC circuit breaker is usually composed of semiconductor units, and the current layout structure of the semiconductor unit used in the main branch usually adopts a one-to-one correspondence between each IGBT component in the semiconductor unit and its corresponding diode component. This layout method causes the structure of the semiconductor unit to be not compact enough, and it is difficult to apply i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/567H03K17/08H03K17/081G05F1/46
CPCG05F1/46H03K17/08H03K17/08112H03K17/567H03K2017/0806
Inventor 乔丽王成昊王治翔张晓龙
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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