Tinned copper wire electroplating method

Abstract

The invention belongs to the technical field of electroplating, in particular to a tinned copper wire electroplating method. An electroplating device in the present invention comprises an electroplating bath, the rotating shafts are rotationally mounted at the two sides of the top end of the electroplating bath through the mounting plates, and more than two pulleys are fixed on the surfaces of thetwo rotating shafts at equal intervals. A dryer is fixed to the top end of the electroplating bath, two or more rectangular grooves are formed at the bottom of an inner cavity of the electroplating bath at equal intervals, and the sleeves are slidably connected into the rectangular grooves correspondingly. Two or more rollers are arranged at the two sides of the electroplating bath correspondingly, the roller at one side of the electroplating bath is driven by a motor, and a controller is arranged on the electroplating bath. The electroplating device comprises a push rod motor, a piston and other structures, during the moving process of the piston, the sleeve can be pushed to continuously move, and during the moving process of the sleeve, the electroplating liquid in the electroplating bath is driven to generate surging, so that the impurities in the electroplating bath cannot precipitate, the electroplating liquid is more uniform, and the electroplating effect is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a tinned copper wire electroplating method. Background technique [0002] Copper wire tinning is widely used in the production of wires, cables, and enameled wires. The tin coating is bright and silvery white, which can increase the weldability and decoration of copper without affecting electrical conductivity. It can be used in the electronics industry, furniture, food packaging, etc. Anti-oxidation, increase the beauty of copper workpieces. [0003] At present, there are two main problems in tinning copper wires. One is that the copper wires are placed in coils when they are put into the electroplating pool, and the surfaces of the copper wires will contact each other. The parts that the copper wires touch cannot be electroplated, resulting in electroplating The effect is poor. The second is that the surface of the copper wire is not sufficiently treated during pretreat...

AI Technical Summary

Problems solved by technology

[0003] At present, there are two main problems in tinning copper wires. One is that the copper wires are placed in coils when they are put into the electroplating pool, and the surfaces of the copper wires will contact each other. The parts that the copper wires touch cannot be electroplated, resulting in electroplating The effect is poor. The second is that the surface of the copper wire is not sufficiently treated during pretreatment, resulting in impurities attached to the surface of the copper wire. The impurities will cause the copper wire to produce protrusions during electroplating. This protrusion will fail early when the copper wire is used later. Cause the electroplating failure of copper wire, affect the use effect of electroplated copper wire, accordingly, the present invention proposes a kind of tinned copper wire electroplating method

Images