Continuous composite molding light photovoltaic module and continuous composite molding equipment thereof

Abstract

The invention discloses a continuous composite molding light photovoltaic module that comprises a photovoltaic laminated piece and a light photovoltaic back plate, wherein the photovoltaic laminated piece comprises a front flexible packaging layer, a battery piece layer and a back flexible packaging layer which are laminated and packaged into a whole; the light photovoltaic back plate at least comprises a thermoplastic core layer and a first thermoplastic substrate layer which are honeycomb-shaped or porous foaming-shaped, and the photovoltaic laminated piece and the light photovoltaic back plate are compounded into a whole through a continuous composite molding process; the invention further discloses continuous composite molding equipment. The module and equipment have the advantages oflight weight, safety, reliability, no frame design, low possibility of dust accumulation, no need of grounding, and flexible and changeable model; the problem of high burst of a traditional double-glass assembly is avoided, the problems of bubbling, degumming, deformation, wriggling and the like cannot occur under the scheme of using the light photovoltaic back plate of an adhesive film layer structure, meanwhile, the limitation of the thickness of the light photovoltaic back plate is avoided, the photovoltaic standard requirement is completely met, and real-scale application and popularization can be achieved.

Description

technical field [0001] The invention belongs to the photovoltaic encapsulation technology, and in particular relates to a continuously composite-molded lightweight photovoltaic module, and the invention also relates to a continuous composite-molded equipment used in the continuously composite-molded lightweight photovoltaic module. Background technique [0002] Reliability, safety and low cost are requirements that any energy product must meet at the same time. In the past few decades, the photovoltaic industry has reduced the cost of photovoltaic products by as much as 300 times in the past 40 years through continuous and high-quality research and development to improve photoelectric conversion efficiency, supply chain and localization and automation of production equipment. Of course, over the past few decades, the cost of photovoltaic cells has been significantly and effectively reduced to the extreme. Both the limit of conversion efficiency and the scale effect of produc...

AI Technical Summary

Problems solved by technology

[0010] Although these comparative documents propose the design of using the structure of the substrate layer and the honeycomb core layer to directly replace the backplane and the aluminum frame, these technologies all use an adhesive layer or an adhesive film layer to realize the connection between the substrate layer and the honeycomb core layer. Connection and compounding, however, as mentioned in Reference 1, the composite structure applied to the photovoltaic backsheet will cause problems such as bubbling, degumming, deformation and creep during subsequent lamination, which will seriously affect the effect of the final photovoltaic module product. Moreover, since the conventional idea of ​​photovoltaic packaging technology is to use adhesive film layers to connect and compound functional material layers and to use adhesives for connection and compounding, it is also a conventional molding and compounding process for conventional honeycomb panels or foamed panels, which also leads to problems such as The light-weight photovoltaic module solutions in the above-mentioned comparative documents 1-3 are all based on the technical development of the substrate layer and the honeycomb core layer and then compounding them through traditional adhesive films or adhesives, and the applicant found after intensive search that , in order to solve the problems of these composite structures, either set the vent structure, or choose to directly sacrifice its composite effect

Therefore, the current application of these technologies is basically at the laboratory certification or small-scale test level, and it is impossible to truly implement large-scale promotion and application.

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