Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An optical device suitable for laser direct writing exposure equipment

An optical device and laser direct writing technology, applied in the field of optical systems, can solve problems such as low production capacity and processing, and achieve the effects of compact structure, convenient disassembly and installation, and low processing cost

Active Publication Date: 2021-08-06
俞庆平
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When processing small line widths, the production capacity is extremely low; when processing large line widths, there are no advantages in terms of production capacity and price compared to traditional machines

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An optical device suitable for laser direct writing exposure equipment
  • An optical device suitable for laser direct writing exposure equipment
  • An optical device suitable for laser direct writing exposure equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be further described below in conjunction with accompanying drawing:

[0022] Such as Figure 1-4 As shown, the optical device suitable for laser direct writing exposure equipment in this embodiment includes an MLA assembly 1, an adapter seat 2, a lens assembly 3 and a magnification adjustment assembly 4. The MLA assembly 1 is installed on one end of the adapter seat 2, and the The other end of the socket 2 is fixedly connected to one end of the lens assembly 3 , and the other end of the lens assembly 3 is fixedly connected to the magnification adjustment assembly 4 . Various lenses are installed in the lens assembly 3 .

[0023] The MLA component 1 includes an MLA chip 11 , a fixing device 12 for fixing the MLA chip 11 and a cooling device 13 for dissipating heat from the MLA chip 11 . In actual use, the structure and size of the fixing device 12 can be set according to the adapter seat 2 , and a compression ring 9 is provided between the he...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an optical device suitable for laser direct writing exposure equipment, comprising an MLA assembly, an adapter seat, a lens assembly and a magnification adjustment assembly, the MLA assembly is installed at one end of the adapter seat, and the adapter seat The other end of the lens assembly is fixedly connected with one end of the lens assembly, the other end of the lens assembly is fixedly connected with the magnification adjustment assembly, and various lenses are installed in the lens assembly. The invention simplifies the structure of the original optical system components, reduces the production cost, makes the structure compact and facilitates assembly and debugging.

Description

technical field [0001] The invention relates to the technical field of optical systems, in particular to an optical device suitable for laser direct writing exposure equipment. Background technique [0002] In the field of direct image transfer technology, there are two relatively traditional direct image transfer technologies, one is the direct image transfer technology of DMD, and the other is the direct image transfer technology of rotating prism. [0003] Direct image transfer technology of rotating prisms. This technology mainly uses single-point scanning technology, which is inferior to the DMD direct image transfer technology mentioned below in terms of production capacity, and its processing accuracy is better than that of DMD direct image transfer technology. This technology is a patented technology of the Israeli company Orbotech, which is mainly used in circuit board LDI and other products. [0004] Using DMD's direct image transfer technology. The core compone...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/2057G03F7/70291
Inventor 俞庆平
Owner 俞庆平
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products