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Preparation method of metal grid line

A technology of metal grid wires and grid wires, which is applied in the field of preparation of metal grid wires on stainless steel substrates, can solve the problems of battery reliability, battery conversion efficiency, and restrictions on the development of flexible batteries.

Pending Publication Date: 2019-11-15
上海祖强能源有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0004] At present, the flexible thin film battery interconnection structure formed by the traditional flexible thin film battery interconnection method has the problems of battery reliability and battery conversion efficiency, which restricts the development of flexible battery technology.

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  • Preparation method of metal grid line
  • Preparation method of metal grid line
  • Preparation method of metal grid line

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Embodiment Construction

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention are clearly and completely described below. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] At present, taking flexible copper indium gallium selenide (CIGS for short) thin-film solar cells as an example, multi-layer thin films are prepared on stainless steel substrate materials by co-evaporation or magnetron sputtering to form solar cell chips. Due to the low current and voltage of a single battery chip, it is not conducive to the application of battery components. Therefore, generally, a low-resistance copper wir...

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Abstract

The invention discloses a method for preparing a metal grid line. The method comprises the steps that a solar cell chip to be interconnected is provided, wherein the cell chip comprises a flexible substrate and a transparent conductive film layer arranged on one side of the flexible substrate; the upper surface of the transparent conductive film layer is laminated with a release film with width larger than the width of the cell chip; according to a set grid line pattern, the release film is laser-ablated to form a grid line pattern with a first trench penetrating the thickness of the release film on the release film; the transparent conductive film layer is scribed through the first trench; a second trench is formed on the transparent conductive film layer; the second trench and the firsttrench on the release film directly facing the transparent conductive film layer are collinearly aligned and communicated; metal layers are simultaneously deposited in the first trench and the secondtrench to form the metal grid line with the set grid line pattern. According to the invention, the method of burying a grid by laser is adopted, which improves the reliability of a cell and the conversion efficiency of the cell.

Description

technical field [0001] The invention relates to the technical field of interconnection of solar cells, in particular to a method for preparing metal grid wires on a stainless steel substrate. Background technique [0002] Copper indium gallium selenide (CIGS for short) solar cells rely on their own excellent performance to gradually increase their photoelectric conversion efficiency. As a light-absorbing layer, the CIGS thin film plays a vital role in the performance of the battery. The low crystallization energy enables CIGS films to be prepared by a series of low-cost and large-scale processes (including vacuum evaporation, magnetron sputtering, etc.), which lays the foundation for its commercial application, but it needs to be coated to a certain extent. Open the chamber for maintenance of equipment or raw materials, refill raw materials or replace new sputtering targets, reducing production efficiency. Therefore, how to shorten the maintenance time, reduce the maintenan...

Claims

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Application Information

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IPC IPC(8): H01L31/0224H01L31/0465
CPCH01L31/022425H01L31/0465Y02E10/50
Inventor 陈涛
Owner 上海祖强能源有限公司
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