A room temperature curing epoxy potting adhesive used under warm and shock environment conditions and preparation method thereof

A technology that cures under ambient conditions and at room temperature. It is applied in the field of potting adhesives, which can solve problems such as easy cracking and debonding, and achieve good process performance.

Active Publication Date: 2021-06-22
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the potting glue in the prior art is easy to crack and debond when it is used in the warm shock environment, the present invention proposes a room temperature curing epoxy potting glue used in the warm shock environment and its preparation method

Method used

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  • A room temperature curing epoxy potting adhesive used under warm and shock environment conditions and preparation method thereof
  • A room temperature curing epoxy potting adhesive used under warm and shock environment conditions and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0041] An epoxy potting adhesive that cures at room temperature and is used under warm and shock environment conditions, including: 33g epoxy resin E44, 15g 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate TDE-85, 12g tetrahydrofuran polyether epoxy (fnhy), 6.2g dibasic polyetheramine EDR104, 4.1g dibasic polyetheramine D230 and 0.6g benzyldiamine (BDMA).

[0042] This example also provides a preparation method for the above-mentioned epoxy potting glue that is cured at room temperature and used under warm-shock environment conditions. Potting compound.

Embodiment 2

[0044] An epoxy potting adhesive that cures at room temperature and is used under warm and shock environment conditions, including: 33g epoxy resin E51, 15g 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate TDE-85, 12g tetrahydrofuran polyether epoxy (fnhy), 8.0g dibasic polyetheramine EDR148, 5.3g dibasic polyetheramine D230 and 1.3g benzyldiamine (BDMA).

[0045] This example also provides a preparation method for the above-mentioned epoxy potting glue that is cured at room temperature and used under warm-shock environment conditions. Potting compound.

Embodiment 3

[0047] An epoxy potting adhesive that cures at room temperature and is used under warm and shock environment conditions, including: 33g epoxy resin E51, 15g 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate TDE-85, 12g polypropylene glycol diglycidyl ether (bechy), 9.8g dibasic polyetheramine EDR176, 6.5g dibasic polyetheramine D230 and 0.8g 2,4,5-tris(dimethylaminomethyl)phenol ( DMP-30).

[0048] This example also provides a preparation method for the above-mentioned epoxy potting glue that is cured at room temperature and used under warm-shock environment conditions. Potting compound.

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Abstract

The invention discloses an epoxy potting glue used in warm shock environment conditions and a preparation method thereof, and relates to the technical field of potting glue used in warm shock environment conditions. Components comprising the following parts by mass: 100 parts of composite epoxy resin; 10 to 30 parts of composite curing agent; the composite epoxy resin is composed of liquid bisphenol A epoxy resin, liquid glycidyl ester epoxy resin and The polyether epoxy is composed of three kinds of epoxy; the composite curing agent is composed of a liquid composite polyether amine and a curing accelerator. By using high activity, good bonding performance, low temperature resistant epoxy, high toughened epoxy and bisphenol A epoxy compounded into a composite epoxy, while using low temperature resistant, high toughness polyether amine as the main curing agent, and through curing The agent is used to adjust the curing speed of the glue, to achieve the balance of the activity, toughness, bonding performance and process performance of the glue, to realize that the potting glue does not crack and debond from the metal under the above environmental conditions, and has good process performance at the same time.

Description

technical field [0001] The invention relates to the technical field of potting glue used under warm shock environment conditions, and more specifically relates to a room temperature curing epoxy potting glue used under warm shock environment conditions and a preparation method thereof. Background technique [0002] General-purpose potting adhesives include epoxy, polyurethane and silicone potting adhesives, etc. Among them, epoxy potting adhesives have better comprehensive performance, so epoxy potting adhesives are selected under warm-shock conditions, and there are no reports in the literature. Epoxy potting adhesives that are subject to temperature shocks, such as Zhuang Mian's article "Preparation of Room Temperature Curing Epoxy Potting Adhesive", and Liao Hong's article "Development of Low Viscosity Room Temperature Curing Epoxy Potting Adhesive" have not mentioned And the researched epoxy potting glue is used under the condition of warm shock environment, Gao Shengman...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C08G59/50C08G59/68
CPCC08G59/504C08G59/686C08L2205/025C08L2205/03C09J163/00C08L63/00
Inventor 陈茂斌吴冶平赵秀丽张帮友陈忠涛陈茂廖宏张银宇
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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