Stratospheric airship equipment cabin temperature control system

Abstract

The invention discloses a stratospheric airship equipment cabin temperature control system, and belongs to the field of temperature control. The system is small in power consumption, light in weight,high in efficiency, small in noise and free of pollution, and can meet the use conditions of stratospheric airship equipment cabins under different working conditions. The system comprises a first temperature control system and a second temperature control system, the first temperature control system comprises components such as a fan, a cold plate and a flute pipe, and is used for cooling electronic equipment in an equipment cabin and air in the cabin at the low altitude, the second temperature control system comprises a semiconductor refrigeration sheet, a fan and the like, and the problem that a single cold source at high altitude cannot meet the refrigeration requirement is prevented. In addition, the heat generated by the electronic equipment can be used for heating the air in the equipment cabin, an electric heating wire is prevented from being directly used for heating, and the electric energy is saved. In order to avoid the problem that pressure in the equipment cabin is too high and influences the sealing of the equipment cabin, a pressure relief valve is arranged on the side wall of an equipment cabin body.

Description

technical field [0001] The invention belongs to the field of temperature control, in particular to a temperature control system for an equipment compartment of a stratospheric airship. Background technique [0002] The semiconductor refrigeration chip does not need any refrigerant, is pollution-free, and can work continuously; there are no moving parts, no vibration and noise; the thermal inertia is small, and the cooling time is short, and the refrigeration chip can reach the maximum temperature difference in a short period of time. Due to these advantages of semiconductor refrigeration, semiconductor refrigeration chips have been increasingly used for refrigeration of electronic equipment in recent years. [0003] The temperature control of the equipment compartment is a key and difficult technology in the design of a stratospheric airship. Electronic equipment needs a certain ambient temperature to work. Stratospheric airships usually work at an altitude of 20km, and the...

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Problems solved by technology

Electronic equipment needs a certain ambient temperature to work. Stratospheric airships usually work at an altitude of 20km, and the external temperature is extremely low. If proper measures are not taken for heat preservation, the equipment will not work properly. When the temperature in the equipment cabin is low At present, electric heating wires are usually used for direct heating, which consumes a lot of power

A large number of electronic devices are usually arranged in the equipment compartment. If proper measures are not taken to dissipate heat from the equipment, the equipment will be damaged; at present, cold air from the external environment is often used or a large amount of refrigerant is carried as a direct cooling source or an evaporation cycle is used. The refrigeration system cools the electronic equipment in the equipment compartment of the stratospheric airship, but at an altitude of 20km, the air density is about 0.0881kg / m -3 , the use of cold air from the external environment as a cooling source will have the problem of insufficient cooling capacity; carrying a large amount of refrigerant as a direct cooling source will increase the weight of the system and reduce the payload of the airship; Vibration and noise will be generated during work, the refrigerant is prone to pollution, and the system is heavy

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