Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Passive heat dissipation server node case

A server node, passive technology, applied in the fields of instruments, electrical digital data processing, digital data processing components, etc., can solve the problem of the processor needs to be cleaned regularly and the fault detection function is single, so as to reduce equipment short-circuit faults and improve stability. Sexual, high-tolerance effects

Inactive Publication Date: 2019-11-05
INFORMATION & COMM COMPANY OF STATE GRID HEILONGJIANG ELECTRIC POWER COMPANY +1
View PDF10 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is to solve the problems that existing computer processors need to regularly clean dust, have higher requirements on the working environment, and have a single fault detection function, and propose a passive heat dissipation server node chassis

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Passive heat dissipation server node case
  • Passive heat dissipation server node case
  • Passive heat dissipation server node case

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0019] Specific implementation mode one: the following combination figure 1 Describe this embodiment, the passive heat dissipation server node chassis described in this embodiment includes a hard disk cage module 1, a power module 2, a CPU main circuit board 7, an IO expansion board 8, and a GPU slave circuit board 9;

[0020] The power supply module 2 is used to supply power to the CPU main circuit board 7, the GPU slave circuit board 9 and the hard disk cage module 1;

[0021] Hard disk cage module 1 is used for installing hard disk, and described hard disk is used for storing the data that CPU main circuit board 7 and GPU send from circuit board 9;

[0022] It also includes a data acquisition and monitoring module 3, a chassis shell, a heat pipe 5 and a heat sink 6;

[0023] The chassis shell is a closed structure, the CPU main circuit board 7, the GPU slave circuit board 9, the power supply module 2, the hard disk cage module 1, the IO expansion board 8, the data acquisit...

specific Embodiment approach 2

[0028] Embodiment 2: This embodiment further describes the movable heat dissipation server node chassis described in Embodiment 1, which also includes a desiccant, the desiccant is placed in a breathable material bag, and the breathable material bag is placed on the heat conduction Between the pipe 5 and the chassis shell and on the bottom surface of the chassis shell, it is used to absorb water droplets and water vapor generated on the heat pipe 5 and the inner wall of the chassis shell due to the large temperature difference between inside and outside.

[0029] The desiccant described in this embodiment can absorb the water vapor in the airtight casing, avoiding the large temperature difference inside and outside the casing to cause humidity inside the casing, which will affect the circuit boards in the casing and affect the use of the casing.

specific Embodiment approach 3

[0030] Specific implementation mode three: the following combination figure 2 This embodiment will be described. This embodiment will further describe the movable heat dissipation server node chassis described in the first specific embodiment. In this embodiment,

[0031] The data acquisition and monitoring module 3 includes a voltage sampling circuit 3-1, a data storage module 3-2, a current sampling circuit 3-3, a main processor 3-7, a narrowband communication module 3-8, a first antenna 3-9, a humidity Sensor 3-11, temperature sensor 3-12 and magnetic flux sensor 3-13;

[0032] The signal output end of the voltage sampling circuit 3-1 is connected to the voltage signal input end of the main processor 3-7;

[0033] The voltage sampling circuit 3-1 is used to collect the working voltage signal of each hardware of the server;

[0034] The signal output end of the current sampling circuit 3-3 is connected to the current signal input end of the main processor 3-7;

[0035] T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a passive heat dissipation server node case, and belongs to the technical field of computer science. The computer processor solves the problems that an existing computer processor needs timing ash removal, has high requirements for the working environment and is single in fault detection function. The case is a closed shell, so that dust in an external working environment cannot enter the heat dissipation shell, and equipment short-circuit faults caused by the dust are reduced. A voltage sensor and a current sensor are used for collecting input and output voltage and current of a CPU main circuit board and a GPU slave circuit board; whether input and output signals and voltage and current of the system are detected at the same time. Whether software and hardware ofthe passive heat dissipation server node case work or not is monitored; the working state of the system is monitored in real time, when it is detected that the input current or voltage and the outputcurrent or voltage of the CPU master circuit board and the GPU slave circuit board are zero, it is indicated that case hardware breaks down or the system breaks down, a power source is restarted, andthe system is reset in time.

Description

technical field [0001] The invention belongs to the technical field of computer science, and in particular relates to a computer server case. Background technique [0002] At present, the common server processor works in an active cooling mode. The huge working noise and the harsh demand for dust make traditional computer server equipment unable to be used in the working environment outside the information room. Although the distributed computing method has many advantages, it is limited. In the working environment of the computer room, the cost is still high, and it has not been widely used. There are high requirements for the temperature, humidity, dust and mechanical vibration of the working environment. Since the design of the air circuit of the whole machine, the casing cannot be completely sealed, so that the dust in the outside working environment can enter the inside of the casing while there is a large amount of air exchange. , increasing the short-circuit failure ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/18G06F1/20G06F11/30G06F11/32
CPCG06F1/181G06F1/20G06F11/3058G06F11/325
Inventor 赵威孙绍辉李岳泽尚书智王鑫淼曹勇
Owner INFORMATION & COMM COMPANY OF STATE GRID HEILONGJIANG ELECTRIC POWER COMPANY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com