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A metal micro-component interconnection method based on electrochemical deposition

A technology for depositing metal and micro-components, which is applied to electrolytic components, electrolytic processes, cells, etc., can solve the problems of low success rate of metal micro-components, and achieve the effects of short preparation cycle, low preparation cost, and improved success rate.

Active Publication Date: 2021-03-30
诸暨市金乐机械有限公司
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Problems solved by technology

[0003] In order to solve the problem of low success rate when interconnecting metal micro-components by welding method, the present invention proposes a metal micro-component interconnection method based on electrochemical deposition

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  • A metal micro-component interconnection method based on electrochemical deposition
  • A metal micro-component interconnection method based on electrochemical deposition
  • A metal micro-component interconnection method based on electrochemical deposition

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Embodiment Construction

[0036] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] to combine figure 1 and figure 2 Note that the interconnected metal micro-components in this embodiment are two micro copper wires, the length of the micro copper wires is 100 μm, and the radius is 10 μm. One end of one of the micro-copper wires is in vertical contact with the middle of another micro-copper wire, and the contact point is a connection point. The electrolyte used in this embodiment has a concentration of 200mol / m 3 copper sulfate solution;

[0038] In this embodiment, the metal micro-component interconnection method based on electrochemical deposition is carried out ac...

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Abstract

The invention discloses a metal micro component interconnecting method based on electrochemical deposition and relates to a metal micro component interconnecting method. The method aims at solving theproblem that when a welding method is used for conducting interconnecting on micro components, the success rate is low. The method includes the steps that the metal micro components make contact withan electric conduction substrate, a liquid moving pipe is filled with an electrolyte, the electrolyte is a metal salt solution of an operation object, a wire is put in the electrolyte in the liquid moving pipe and is connected to a power anode, the material of the wire is the same with that of deposited metal, and the electric conduction substrate is connected with a power cathode; and the electrolyte in the liquid moving pipe is connected with the micro components to form a loop, after electrifying, a reduction reaction happens to the cathode, namely the positions of the metal micro components, metal deposition is generated between the micro components and the liquid moving pipe, metal is deposited and covers the metal micro components at the moment, and interconnecting between the metalmicro components is achieved. The metal micro component interconnecting method can be applied to a micro electro mechanical system complex in manufacturing. The metal micro component interconnectingmethod is conducted at a normal temperature during interconnecting, a high temperature is not generated during deposition, and therefore irreversible damage cannot be caused on the metal micro components. The interconnecting success rate of the metal micro component interconnecting method can reach 100%, and various types of metal micro components can be connected; and the metal micro component interconnecting method is suitable for interconnecting of metal micro components.

Description

technical field [0001] The invention relates to a metal micro-component interconnection method. Background technique [0002] Micro-components refer to micro-scale components, and the more common ones are wire-shaped metal micro-components, such as micro-copper wires. When assembling metal micro-components by welding, the high temperature generated will cause irreversible damage such as deformation and damage to the components, resulting in interconnection failure and reducing the success rate of assembly. Contents of the invention [0003] In order to solve the problem of low success rate when interconnecting metal micro-components in the existing welding method, the present invention proposes a method for interconnecting metal micro-components based on electrochemical deposition. [0004] The metal micro-component interconnection method based on electrochemical deposition of the present invention is carried out according to the following steps: [0005] Step 1. Take th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D21/12C25D5/04
CPCC25D5/04C25D17/00C25D21/12
Inventor 李东洁许吉勇杨柳荣伟彬俞敏峰尤波
Owner 诸暨市金乐机械有限公司
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