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Corrosion-resistant coating for interface of electronic device

An electronic equipment, corrosion-resistant technology, applied in the direction of contact parts, etc., can solve the problems of reduced electrical conductivity, peeling off of the electroplating layer, poor adhesion between the electroplating layer and the substrate material, etc., to achieve good wear resistance, adhesion and welding. good performance

Inactive Publication Date: 2019-11-01
东莞市合航精密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the popularization of electronic products, the application of electronic products is becoming more and more extensive. During the use of electronic products, the electronic interface is often plugged and unplugged. Being oxidized and corroded, poor electrical contact often occurs. In order to improve wear resistance and corrosion resistance, many electronic interface terminals are electroplated with electroplating coatings. Electroplating coatings generally include a wear-resistant layer and an anti-oxidation corrosion layer. Due to the limited thickness of the coating, otherwise the excessive thickness will cause large internal stress and easy to fall off; therefore, the wear resistance and corrosion resistance of the terminal are not enough; if the thickness of the coating is too thick, its electrical conductivity will be reduced; in addition, Some electroplating coatings ignore the combination with the base material. After electroplating, the adhesion between the electroplating coating and the base material is poor, which will cause the electroplating layer to fall off during later use. In severe cases, it will also affect the electronic interface and the circuit board. The soldering relationship caused the electronic interface to fall off

Method used

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  • Corrosion-resistant coating for interface of electronic device

Examples

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Embodiment 1

[0025] This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating layer 1, a gold coating layer, a first silver coating layer 3, a second gold coating layer 4, a third coating layer, and Rhodium ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of described nickel-tungsten layer 1 is 0.5 micron, the thickness of described gold-plated layer is 0.025 micron, the thickness of described first silver-plated layer 3 is 0.5 micron, described The thickness of the second gold-plated layer 4 is 0.025 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 0.25 microns, and the thickness of the fourth gold-plated layer 6 is 0.025 microns.

Embodiment 2

[0027] This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating layer 1, a gold coating layer, a first silver coating layer 3, a second gold coating layer 4, a third coating layer, and Rhodium ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of described nickel-tungsten layer 1 is 5 microns, the thickness of described gold-plated layer is 0.25 microns, the thickness of described first silver-plated layer 3 is 6 microns, described The thickness of the second gold-plated layer 4 is 0.5 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 4 microns, and the thickness of the fourth gold-plated layer 6 is 0.25 microns.

[0028] The pre-plating layer 2 of embodiment 1 and embodiment 2 selects the gold-plated layer to ensure the bonding force of the gold-plated layer and enhance the wear resistance and anti-corrosion ability. Compared with the silver-plated layer, althoug...

Embodiment 3

[0030] This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating 1, a silver coating, a first silver coating 3, a second gold coating 4, a third Rhodium-plated ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of described nickel-tungsten layer 1 is 0.5 micron, the thickness of described silver-plated layer is 0.025 micron, the thickness of described first silver-plated layer 3 is 0.5 micron, The thickness of the second gold-plated layer 4 is 0.025 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 0.25 microns, and the thickness of the fourth gold-plated layer 6 is 0.025 microns.

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Abstract

The invention relates to the technical field of electroplating, in particular to a corrosion-resistant coating for an interface of an electronic device. The corrosion-resistant coating comprises a substrate plating layer plated on a surface of a substrate, the substrate plating layer is a nickel-plated tungsten layer for improving corrosion resistance of the substrate, the surface of the nickel-plated tungsten layer is plated with a pre-plating layer for improving the adhesion of adjacent plating layers, a first silver plating layer for improving corrosion resistance and the electrical conductivity of the substrate, and a second gold plating layer for improving adhesion of adjacent plating layers. a third rhodium layer for improving corrosion resistance and wear resistance of the substrateand a fourth gold plating layer for improving the solderability of the substrate. The coating structure combined by the above plating layers has the better wear resistance, oxidation resistance, electrical conductivity and corrosion, and the adhesion between the plating layer and the substrate material is good, and the welding property of the substrate is also improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a corrosion-resistant coating for an interface of an electronic device. Background technique [0002] With the popularization of electronic products, the application of electronic products is becoming more and more extensive. During the use of electronic products, the electronic interface is often plugged and unplugged. Being oxidized and corroded, poor electrical contact often occurs. In order to improve wear resistance and corrosion resistance, many electronic interface terminals are electroplated with electroplating coatings. Electroplating coatings generally include a wear-resistant layer and an anti-oxidation corrosion layer. Due to the limited thickness of the coating, otherwise the excessive thickness will cause large internal stress and easy to fall off; therefore, the wear resistance and corrosion resistance of the terminal are not enough; if the thickness of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/03C25D5/10C25D7/00
CPCC25D5/10C25D7/00H01R13/03
Inventor 周海湖
Owner 东莞市合航精密科技有限公司
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