Mxene-PDMS composite foam with hollow structure, and preparation method and application of Mxene-PDMS composite foam

Abstract

The invention relates to Mxene-PDMS composite foam with a hollow structure, and a preparation method and application of the Mxene-PDMS composite foam. A sensing active part of a sensor is the Mxene-PDMS hollow foam. In the hollow Mxene-PDMS foam, Mxene is dispersed in inner surfaces of the foam holes. According to the invention, the Mxene-PDMS foam with a well-bent hollow structure can be obtainedby optimizing the impregnation times of Mxene nanosheets in a process of preparing the sensor and by optimizing the treatment steps of the usage amount of a PDMS curing agent required in the preparation process and the like. Due to lap joint of a Mxene sheet layer on the inner surfaces of the holes, the Mxene sheet layer is shaken when being subjected to external micro stimulation, and the Mxenesheet layer is more sensitive to detection under micro pressure. According to the design of the hollow structure, stable circulation performance and sensitivity can be achieved when large-angle bending and compression are carried out.

Description

technical field [0001] The invention belongs to the technical field of flexible wearable electronic devices and new materials, in particular to a hollow-structured MXene-PDMS composite foam and its preparation method and application, especially a novel hollow-structured MXene-PDMS composite foam and its preparation Methods and high bending piezoresistive pressure sensors assembled using this hollow foam structure. Background technique [0002] With the continuous development of electronic technology, sensors as one of them have also attracted widespread attention. There are various types of sensors such as gas and vapor sensors, biosensors, strain and pressure sensors, etc. Among them, pressure sensors have made remarkable achievements in recent decades, especially piezoresistive sensors. Sensors that convert mechanical deformation into electrical signals for monitoring. Due to its high fabrication cost, simple device microstructure, fast response, and good stability, pie...

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Problems solved by technology

At present, the research of using nickel foam as the framework to prepare sensors (documents 1, 2, 3) and the research of using MXene as a conductive material (documents 4, 5) are cumbersome or costly, and the sensing range is not comprehensive enough, and Difficult to achieve mass production

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