Method for growing single crystal [gamma]-phase indium selenide film on mica substrate
A technology for growing single crystals and indium selenide, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of high preparation costs and achieve the effect of small chemical force and high surface mobility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0025] Such as figure 1 As shown, the present invention is a method for growing a single crystal γ-phase indium selenide thin film on a mica substrate, specifically comprising the following steps:
[0026] Step 1): Carry out chemical cleaning and mechanical cleavage to peel off the surface layer of the single crystal mica substrate to obtain a flat mica substrate with a clean surface. In the example, ultrasonic cleaning with acetone for 3 minutes, ultrasonic cleaning with alcohol for 3 minutes, and repeated ultrasonic cleaning for 3 rounds ;
[0027] Step 2): The mica substrate prepared in step 1) is introduced into the molecular beam epitaxy vacuum system and heated for degassing. When the maximum degassing temperature is 450°C, stop heating, and degass until the pressure of the molecular beam epitaxy vacuum system reaches 5 ×10 -10 mbar, stop degassing;
[0028] Step 3): After cooling to the growth temperature of 200°C, turn on the In source and the Se source in the molec...
Embodiment 2
[0039] The invention is a method for growing a single crystal γ-phase indium selenide thin film on a mica substrate, which specifically includes the following steps:
[0040] Step 1): Carry out chemical cleaning and mechanical cleavage to peel off the surface layer of the single crystal mica substrate to obtain a flat mica substrate with a clean surface. In the example, ultrasonic cleaning with acetone for 4 minutes and alcohol ultrasonic cleaning for 4 minutes, repeated ultrasonic cleaning for 3 rounds ;
[0041] Step 2): Put the mica substrate prepared in step 1) into the molecular beam epitaxy vacuum system and heat to degas. When the maximum degassing temperature is 450°C, stop heating, and degas until the pressure of the molecular beam epitaxy vacuum system reaches 2.5 ×10 -10 mbar, stop degassing;
[0042] Step 3): After cooling to the growth temperature of 230°C, turn on the In source and the Se source in the molecular beam epitaxy vacuum system, where the equivalent ...
Embodiment 3
[0049] The invention is a method for growing a single crystal γ-phase indium selenide thin film on a mica substrate, which specifically includes the following steps:
[0050] Step 1): Carry out chemical cleaning and mechanical cleavage to peel off the surface layer of the single crystal mica substrate to obtain a flat mica substrate with a clean surface. In the example, ultrasonic cleaning with acetone for 5 minutes and alcohol ultrasonic cleaning for 5 minutes, repeated ultrasonic cleaning for 3 rounds ;
[0051] Step 2): Put the mica substrate prepared in step 1) into the molecular beam epitaxy vacuum system and heat it to degas. ×10 -10 mbar, stop degassing;
[0052] Step 3): After cooling to the growth temperature of 250°C, turn on the In source and the Se source in the molecular beam epitaxy vacuum system, where the equivalent pressure of the In beam is 1×10 -7 mbar, Se beam equivalent pressure is 1×10 -6 mbar, set the Se cracking temperature to 450°C, and the Se:In b...
PUM
Property | Measurement | Unit |
---|---|---|
Root mean square roughness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com