Chip component slitting, molding detection and braiding linkage integrated machine

Abstract

The invention discloses a chip component slitting, molding detection and braiding linkage integrated machine. The chip component slitting, molding detection and braiding linkage integrated machine comprises a rack. A feeding channel is mounted on the rack. A feeding mechanism, a clamping and conveying mechanism, a slitting mechanism and a rotary disk mechanism are arranged on the feeding channel in sequence. A first wire bending mechanism, a second wire bending mechanism, an electric detection mechanism, a first defective product discharge tank, a CCD contour detection mechanism, a second defective product discharge tank and a discharging and braiding mechanism are arranged on the periphery of the rotary disk mechanism in sequence. A molding driving mechanism is mounted on the lower side of the rack. The molding driving mechanism drives the first wire bending mechanism and the second wire bending mechanism. The first wire bending mechanism and the second wire bending mechanism are matched with the rotary disk mechanism to operate. The discharging and braiding mechanism comprises a braiding channel. A braid charging position, a CCD braid charging detection mechanism, a braid covering mechanism and a braid carrying reel are arranged along the braiding channel in sequence. The chip component slitting, molding detection and braiding linkage integrated machine realizes slitting, molding detection and packaging full-automatic of chip components, improves the braiding efficiency and saves the braiding cost.

Description

technical field [0001] The invention relates to an integrated machine for slitting, forming, and testing, in particular to an integrated machine for slitting, forming, testing, and braiding of chip components, which belongs to the technical field of chip component processing equipment. Background technique [0002] With the development of science and technology and the improvement of electronic technology level, as well as the miniaturization of electronic products, the further improvement of performance and reliability, electronic components have developed from large, heavy and thick to small, light and thin. Capacitors, thermistors, varistors and other chip components, chip components need to go through chip welding, plastic sealing, slitting, lead forming, taping and other processes in the production process, traditional chip component production requires different equipment It is carried out step by step, and there are many manual parts involved, the processing cost is h...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology and the improvement of the level of electronic technology, as well as the miniaturization of electronic products, the further improvement of performance and reliability, electronic components have developed from large, heavy, and thick to small, light, and thin. Capacitors, thermistors, varistors and other chip components, chip components need to go through chip welding, plastic sealing, slitting, lead forming, taping and other processes in the production process, traditional chip component production requires different equipment It is carried out step by step, there are many manual parts involved, the processing cost is high, the processing efficiency is low, and it is easy to produce waste components

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