Packaging structure for display

A packaging structure and display technology, applied in applications, electronic equipment, household appliances, etc., can solve the problems of complex film-forming equipment, unfavorable film properties, degradation or yellowing, etc., achieve low light transmittance and reflectance, and improve quality and stability, good shading effect

Pending Publication Date: 2019-10-11
UNIFLEX TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this method can make the polyimide film present the desired black color, the film-forming equipment is complicated, the process requirements are high, and it is difficult to popularize, and the additional black film layer will increase the production cost, and it will also affect the properties of the film. Detrimentally affects the deterioration or yellowing of this two-layer polyimide film when exposed to high temperatures

Method used

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  • Packaging structure for display
  • Packaging structure for display
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Embodiment Construction

[0046] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.

[0047] Figure 1 to Figure 5 It is a schematic cross-sectional view of a manufacturing process of a packaging structure for a display according to an embodiment of the present invention. The packaging structure 100 of this embodiment is suitable for displays, such as polymer organic light-emitting diode (PolymerLight-Emitting Diode, PLED) display, organic light-emitting dio...

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Abstract

The utility model provides a packaging structure for a display. The packaging structure comprises a flexible base film, a plurality of connection pads, a light-emitting element array and a patterned circuit layer. Wherein the flexible base film comprises a plurality of through holes, a first surface and a second surface opposite to the first surface, the through holes are communicated with the first surface and the second surface, and the flexible base film is a black flexible base film. The connection pad is arranged on the first surface, and the conduction hole is connected with the connection pad. The light-emitting element array comprises a plurality of light-emitting element groups, the light-emitting element groups are arranged on the connection pads and electrically connected with the connection pads, and each light-emitting element group comprises a plurality of light-emitting elements with different colors. The patterned circuit layer is disposed on the second surface and is electrically connected to the via hole.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure for a display. Background technique [0002] Driven by the development trend of thinner intelligent electronic equipment and higher density of internal circuit design, the use of reliable heat dissipation design inside electronic equipment has become a basic requirement to ensure stable operation of equipment. At present, the artificial graphite film prepared by polyimide film has the characteristics of thin thickness, high thermal conductivity, flexibility and easy processing, which can meet the heat dissipation design requirements of the small space inside the electronic device, and has become an important part of various intelligent mobile electronic devices. An important heat dissipation material for the heat dissipation structure. [0003] With the development of aerospace technology, electronic technology, battery and other technologies, in some specific occas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/00H01L27/15
CPCH01L27/156H10K59/35H10K77/111H01L23/3677H01L23/49827H01L23/4985H01L21/486H01L23/145H01L33/62H01L25/0753H01L24/16H01L2924/12041H01L2224/16227H01L2224/16235H01L24/13H01L2224/131Y02E10/549Y02P70/50H01L2924/014H01L23/5384H01L23/5387B32B2457/20B32B15/08B32B15/20B32B27/281H01L33/647
Inventor 刘逸群贾孟寰涂成一李远智
Owner UNIFLEX TECH
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