Horizontal electroless nickel/immersion gold assembly line and electroless nickel/immersion gold method

Abstract

The invention relates to a horizontal electroless nickel / immersion gold assembly line and an electroless nickel / immersion gold method. The horizontal electroless nickel / immersion gold assembly line comprises an automatic plate placing machine, a first micro-etching bath, a first rinsing bath set, a sand blasting machine, a second rinsing bath set, an oil removing bath set, a third rinsing bath set, a second micro-etching bath, a fourth rinsing bath set, a pre-soaking bath, an activated bath set, a fifth rinsing bath set, a pickling bath, a sixth rinsing bath set, a first surface treatment system, a seventh rinsing bath set, a second surface treatment system, a gold recovery bath, an eighth rinsing bath set, an operation station, a ninth rinsing bath set, a blowing-drying bath set, an automatic plate collecting machine and a conveying mechanism which are sequentially arranged. The horizontal electroless nickel / immersion gold assembly line has the effects of being short, suitable for installation and use in general small factories, high in electroless nickel / immersion gold efficiency and high in electroless nickel / immersion gold quality.

Description

Technical field [0001] The invention relates to the technical field of circuit board surface treatment, in particular to a horizontal nickel-gold assembly line and a nickel-gold smelting method. Background technique [0002] Printed PCB boards (circuit boards) are the basic products of modern electronics and information industries. The printed circuit board is based on the pre-designed circuit, and the conductive pattern for the connection between the components is formed on the surface of the board. The manufacturing process has as many as 20 processes. At present, the production process of printed circuit boards includes a series of surface treatment processes for the surface treatment of the plate, such as: desmearing, chemical copper deposition, nickel plating, tin stripping, nickel immersion, gold immersion, nickel and gold, etc. [0003] However, the current treatment process of nickel-gold is generally as follows: board feeding → degreasing → three water washing → pickling ...

AI Technical Summary

Problems solved by technology

[0003] However, the current treatment process of nickel-gold is generally: board entry → degreasing → triple water washing → pickling → double water washing → micro-etching → double water washing → pre-soaking → activation → double water washing → chemical nickel → double water washing → chemical gold → gold Recycling → double water washing → plate output, especially in the steps of chemical nickel and chemical gold, the plate is usually driven in a horizontal motion. In order to ensure that the plate is fully chemically reacted, the chemical nickel and chemical gold steps are usually processed correspondingly. The length of the equipment is longer, which increases the length of the entire horizontal nickel-gold assembly line, so that it is not suitable for installation in general small factories, and the efficiency and quality of nickel-gold are not high, so it needs to be improved

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