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Method for manufacturing an electronic or electrical system, and system which is manufactured in accordance with the method

An electrical system and electronic technology, which is applied in the direction of printed circuits, manufacturing tools, additive manufacturing, etc. connected to non-printed electrical components, can solve problems such as inaccuracy, high power density heating, etc.

Active Publication Date: 2019-10-08
FRIEDRICH ALEXANDER UNIV ERLANGEN NURNBERG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Here, each machine change (compression of layers, drilling of vias, plating, assembly, etc.) is accompanied by re-registration of the workpiece and thus with a certain positional inaccuracy
Finally, another disadvantage of the known circuit boards is that the high power density is accompanied by a correspondingly high heating

Method used

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  • Method for manufacturing an electronic or electrical system, and system which is manufactured in accordance with the method
  • Method for manufacturing an electronic or electrical system, and system which is manufactured in accordance with the method
  • Method for manufacturing an electronic or electrical system, and system which is manufactured in accordance with the method

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Embodiment Construction

[0100] figure 1 A conductive layer is shown with reference numeral 1, which corresponds to the width of the signal line 100 and forms the bottom surface thereof. A dielectric layer 2 is applied on top of this layer, on which, depending on the type of conductor, no conductor tracks, one or more conductor tracks 3 are produced. exist figure 1 Over the entire width of the signal lines shown on the carrier 200 indicated by hatching, a further dielectric encapsulation 4 follows, which together with the layer 2 completely encloses one or more rails. The structure produced in this way is provided with an encapsulation 5 which consists entirely of metal or is metallized at least on its inside or outside and which forms an electrically conductive connection with layer 1 . This results in a completely circumferential, that is to say in the cross-sectional direction, electrically conductive housing. The housing can consist of metal or be metallized or consist of or be coated with an...

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Abstract

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and / or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

Description

technical field [0001] The invention relates to a method for manufacturing an electronic or electrical system. Background technique [0002] It is known from the prior art to manufacture circuit boards photochemically. In this case, planar plates are produced by photolithographic processes, which consist of a dielectric substrate which is coated on one or both sides with a copper foil, so that an electrically conductive and non-conductive layer. A thin layer of light-sensitive photoresist is applied to the surface of the metallized plate. Next, exposure of the photoresist is performed through a mask having a desired wiring pattern of the strip conductors of the plate. Depending on the type of photoresist, exposed or unexposed regions of the photoresist are soluble in the liquid and are removed by means of the liquid, so that there are regions of the copper film coated with photoresist And there are areas where this is not the case. [0003] The plates pretreated in this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02B29C70/88H05K3/12H05K3/46B29C64/112B29L31/34B29K105/00H05K1/09H05K1/18H05K3/00H05K3/40
CPCB29K2995/0005B29K2995/0007B29L2031/3425B29K2105/0058B29C70/882H05K1/0221H05K1/025H05K1/0268H05K1/0274H05K1/0284H05K1/092H05K1/186H05K3/0005H05K3/125H05K3/1283H05K3/4007H05K3/4664H05K3/4685H05K3/4688H05K2201/037H05K2201/098H05K2201/09809H05K2201/09872H05K2201/09981H05K2201/10098H05K2203/013H05K2203/107H05K2203/163B29L2031/3406B29C64/112B33Y80/00Y02P10/25B33Y70/10H05K1/145H05K3/1241
Inventor 格拉尔德·戈尔德克劳斯·黑尔姆赖希约翰内斯·赫尔贝尔康斯坦丁·洛马金马克·西佩尔
Owner FRIEDRICH ALEXANDER UNIV ERLANGEN NURNBERG
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