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LED display adhesive filling method

A technology of LED display and glue filling, which is applied in the direction of instruments, printed circuit secondary treatment, electrical components, etc., can solve the problems of inconsistent display ink color, peeling, and lamp tube falling off, so as to reduce the probability of ion migration and ensure consistency Sexuality, the effect of preventing shedding

Active Publication Date: 2019-10-01
FUJIAN QIANGLI PHOTOELECTRICITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the existing indoor small-pitch LED displays have no protective treatment on the lamp surface. Due to uncertain factors in the installation and use environment, the LED lamp tube pins on the display screen will be oxidized, the lamp tube will fall off, and even the PCB will be damaged. Major quality problems such as stripping of copper clad board and glass fiber cloth, ion migration, and color difference of PCB background color
The existing technology is to add a mask, pour liquid epoxy resin and inkjet on the lamp surface of the LED module for protection or to solve the ink color consistency of the PCB board. When the gap between the LED packages is less than 0.2mm, the process technology, equipment accuracy, Manufacturing costs, product quality, etc. are difficult to meet the requirements of mass production

Method used

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Embodiment Construction

[0017] In the claims and description, unless otherwise defined, terms such as "first", "second" or "third" are used to distinguish different objects, rather than to describe a specific sequence.

[0018] In the claims and specification, unless otherwise defined, the terms "central", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", " The orientation or positional relationship indicated by "Up", "Down", "Front", "Back", "Left", "Right", "Clockwise", "Counterclockwise" etc. are based on the orientation and positional relationship shown in the drawings , and are only for the convenience of simplifying the description, and do not imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation.

[0019] In the claims and description, unless otherwise defined, the term "fixed connection" or "fixed connection" should be understood in a broad sense, that is, any connection meth...

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PUM

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Abstract

The invention discloses an LED display adhesive filling method. An LED display comprises a light board and package bodies arranged on the light board in a matrix mode at intervals; and the LED displayadhesive filling method is characterized in that solid package adhesive strips are laid layer by layer in intervals between the package bodies in an alternate mode of horizontal laying and longitudinal laying; and a baffle encloses around the LED display and is baked to cool the solid package adhesive strips and then cooled. By adopting the above technical scheme, the strips are solid-liquid-converted and placed around each package body of an LED tube to form a solid protective wall, not only lamp pins are protected from oxidation, but also the application force of the LED tube on PCBs is strengthened, the LED tube is prevented from falling off due to external force, the probability of ion migration is reduced, the difference in the bottom colors between the PCB and the PCB are further blocked, and the consistency of the ink color of products is ensured.

Description

technical field [0001] The invention relates to the field of LED display manufacturing, in particular to a glue filling method for an LED display. Background technique [0002] Most of the existing indoor small-pitch LED displays have no protective treatment on the lamp surface. Due to uncertain factors in the installation and use environment, the LED lamp tube pins on the display screen will be oxidized, the lamp tube will fall off, and even the PCB will be damaged. There are major quality problems such as stripping of copper clad on the board circuit and glass fiber cloth, ion migration, and inconsistent display ink color caused by the color difference of the PCB background. The existing technology is to add a mask, pour liquid epoxy resin and inkjet on the lamp surface of the LED module for protection or to solve the ink color consistency of the PCB board. When the gap between the LED packages is less than 0.2mm, the process technology, equipment accuracy, Manufacturing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/33H05K3/28
CPCG09F9/33H05K3/284
Inventor 周宗徐惠能钟如春何国经
Owner FUJIAN QIANGLI PHOTOELECTRICITY
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