High-filling flexible boron nitride composite film material, high-filling flexible boron nitride copper-clad laminate and preparation methods of high-filling flexible boron nitride composite film material and high-filling flexible boron nitride copper-clad laminate

Abstract

The invention relates to a high-filling flexible boron nitride composite film material, a high-filling flexible boron nitride copper-clad laminate and preparation methods of the high-filling flexibleboron nitride composite film material and high-filling flexible boron nitride copper-clad laminate. The high-filling flexible boron nitride composite film material is composed of the following components: in percent by mass, 80-87% of dihydromyricetin-modified hexagonal boron nitride and 13-20% of acrylate copolymer resin. The film material obtained through combination of the dihydromyricetin-modified hexagonal boron nitride and the specific acrylate copolymer resin has excellent flexibility and strength, and has broad application prospects in the fields of electronic circuit board additive manufacture and electronic packaging; horizontal arrangement and orientation of boron nitride sheets are promoted through adoption of a layer-by-layer film-coating mode for preparation of the film material, close stacking of layers can be achieved, and an effective heat conduction path is constructed; and the high-filling flexible boron nitride copper clad laminate which is prepared from the film material has excellent thermal conductivity, good flexibility, can be bent to 20-30 degrees, and can be curled.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic components, and in particular relates to a highly filled flexible boron nitride composite film material, a highly filled flexible boron nitride copper-clad board and a preparation method thereof. Background technique [0002] Hexagonal boron nitride (h-BN) is a typical III-V group compound, which belongs to the hexagonal crystal system and has a layered atomic structure similar to graphite, so it is called white graphite. In the layer, B atoms and N atoms are represented by sp 2 The hybridization method forms covalent bonds, and the structure is stable, while the interlayers are combined by van der Waals force, and the distance between atomic layers is relatively large, which is easy to slip. The energy band gap of hexagonal boron nitride is about 5-6eV, it has excellent high temperature stability and dielectric properties, and the theoretically calculated thermal conductiv...

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the poor compliance of highly filled boron nitride composite thin film materials, the difficulty of obtaining large sheets of highly filled flexible boron nitride composite thin film materials, and the application of high filled flexible boron nitride composite thin film materials in the field of electronic materials Urgent development and other issues are needed to provide a highly filled flexible boron nitride composite thin film material with excellent flexibility and mechanical properties

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