High-frequency polishing quartz wafer with long H-shaped structure

Abstract

The invention discloses a high-frequency polishing quartz wafer with a long H-shaped structure. The high-frequency polishing quartz wafer comprises a rectangular web wafer and two rectangular flange plate wafers, wherein the flange plate wafers are symmetrically arranged on two opposite long side edges of the web wafers to form an H-shaped steel quartz wafer; wherein the length, width and height of the web wafer are respectively X1, Y1 and Z1; the lengths, widths and heights of the flange plate wafers are X2, Y2 and Z2 respectively; wherein X2 is equal to X1; 1.12Z1<=Y2<=1.47Z2; and Z2 is greater than or equal to 0.005Y1 and less than or equal to 0.027Y1. According to the scheme, the piezoelectric quartz crystal frequency piece with the integrated novel structure is processed in a photoetching corrosion manner; according to the appearance and the size of the phase, a simulation result shows that bending vibration and surface shear vibration in the direction can be better restrained byadding frame loading in the width direction, and therefore it is guaranteed that the amplitude of resonance is large enough, and the amplitude of impedance is reduced.

Description

technical field [0001] The invention belongs to the communication field and relates to a high-frequency polished quartz wafer with a long H-shaped structure. Background technique [0002] With the development of 5G communication, the wavelength of communication is getting shorter and shorter, and its communication frequency is getting higher and higher accordingly; the core component of an AT-cut quartz crystal resonator or oscillator is a piezoelectric quartz crystal frequency plate, and its thickness is the same as The resonant frequency satisfies: t=1664 / f (wherein t represents the thickness of the wafer; f represents the frequency of the wafer), by which it can be clearly found that as the resonant frequency of the wafer increases, the thickness of the wafer becomes thinner and thinner . In addition, in order to reduce the impedance of the high-frequency quartz wafer, it is often achieved by changing the surface roughness of the wafer to reduce its resonance damping. T...

AI Technical Summary

Problems solved by technology

[0003] As the wafer becomes thinner and thinner, its surface roughness is low, resulting in lamination of the wafer during the cleaning process

Once the two wafers are stacked together, a vacuum area appears due to the very smooth surface, resulting in the overlapping area cannot be cleaned, resulting in excessive crystal resonator DLD2 (level-dependent characteristics) parameters; if forcibly separated, the wafer will be damaged

Images