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Fluorescent glue capable of improving light spots and packaging process emplopying fluorescent glue

A packaging process and fluorescent glue technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of unstable sedimentation process, low viscosity of fluorescent glue, etc. The basic effect of light color

Inactive Publication Date: 2019-08-23
广东晶锐半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above patents can effectively improve the phenomenon of uneven light color, but the viscosity of the fluorescent glue is slightly small, and the sedimentation process is not stable enough

Method used

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  • Fluorescent glue capable of improving light spots and packaging process emplopying fluorescent glue
  • Fluorescent glue capable of improving light spots and packaging process emplopying fluorescent glue
  • Fluorescent glue capable of improving light spots and packaging process emplopying fluorescent glue

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1: A fluorescent glue for improving light spots, specifically including the following components:

[0028] 15 parts of silicon-based nitride;

[0029] 1 part of spherical micropowder of silicone resin;

[0030] 84 parts of silicone resin;

[0031] The particle size of the silicon-based nitride is 9um, the viscosity of the silicone resin is 4000pcs, and the refractive index is 1.54;

[0032] The preparation process of adopting described fluorescent glue is as follows:

[0033] (1) Put the silicon-based nitride, silicone resin spherical micropowder, and silicone resin into the machine and stir in four stages and vacuumize to prepare fluorescent glue;

[0034] The first stage: the stirring time is 30 seconds, the revolution speed is 600RPM, the rotation speed is 600RPM, and the vacuum value is 1.00KPa;

[0035] The second stage: the stirring time is 100 seconds, the revolution speed is 600RPM, the rotation speed is 400RPM, and the vacuum value is 1.00KPa;

...

Embodiment 2

[0042] Embodiment 2: A fluorescent glue for improving light spots, specifically including the following components:

[0043] 22 parts of europium-doped oxynitride;

[0044] 4 parts of spherical micropowder of silicone resin;

[0045] 76 parts of silicone resin;

[0046] The particle size of the europium-doped oxynitride is 11um, the viscosity of the silicone resin is 4500pcs, and the refractive index is 1.54;

[0047] The preparation process of adopting described fluorescent glue is as follows:

[0048] (1) Put the europium-doped nitrogen oxide, silicone resin spherical micropowder, and silicone resin into the machine and stir in four stages and vacuumize to prepare fluorescent glue;

[0049] The first stage: the stirring time is 30 seconds, the revolution speed is 600RPM, the rotation speed is 600RPM, and the vacuum value is 1.00KPa;

[0050] The second stage: the stirring time is 100 seconds, the revolution speed is 600RPM, the rotation speed is 400RPM, and the vacuum va...

Embodiment 3

[0057] Embodiment 3: A fluorescent glue for improving light spots, specifically including the following components:

[0058] 29 parts of aluminate;

[0059] 3 parts of spherical micropowder of silicone resin;

[0060] 69 parts of silicone resin;

[0061] The particle size of the aluminate is 13um, the viscosity of the silicone resin is 5000pcs, and the refractive index is 1.54;

[0062] The preparation process of adopting described fluorescent glue is as follows:

[0063] (1) Put the aluminate, silicone resin spherical micropowder, and silicone resin into the machine and stir in four stages and vacuumize to prepare fluorescent glue;

[0064] The first stage: the stirring time is 30 seconds, the revolution speed is 600RPM, the rotation speed is 600RPM, and the vacuum value is 1.00KPa;

[0065] The second stage: the stirring time is 100 seconds, the revolution speed is 600RPM, the rotation speed is 400RPM, and the vacuum value is 1.00KPa;

[0066] The third stage: the stirrin...

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Abstract

The invention belongs to the technical field of LED packaging, and discloses fluorescent glue for improving light spots. The fluorescent glue is characterized in that the fluorescent glue contains thefollowing components in parts by weight: 15-40 parts of fluorescent powder; 1-5 parts of diffusion powder; and 55-84 parts of glue, wherein the fluorescent powder is one of silicon-based nitride, europium-doped nitrogen oxide, aluminate and Ga-YAG or more. The invention also discloses a packaging process adopting the fluorescent glue. The invention aims to provide fluorescent glue capable of improving light spots and the packaging process employing the fluorescent glue. Through the improvement of the fluorescent glue, the settling speed of the fluorescent powder is reduced, and the fluorescent powder is effectively and uniformly diffused, so that the refraction route of emergent light is changed, the required color is maximized, the output of other miscellaneous colors is reduced, the surface wrinkling phenomenon of the glue is improved, and the refraction of the light is increased to improve light spots.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a fluorescent glue for improving light spots and a packaging process thereof. Background technique [0002] In the prior art, the overall viscosity of the fluorescent powder mixed with the glue is not enough, and the speed of the sedimentation process is relatively fast, and the phosphor powder diffuses unevenly, resulting in uneven light color of the product and the formation of light spots. [0003] The Chinese patent "A packaging process for white light LED" (application number CN201210334557.X, publication date 2013-02-06) discloses a packaging process for white light LED, including the following steps: mixing, phosphor powder, diffusing agent and glue Mix according to the proportion, stir manually for 5-20 minutes, then use the machine to stir and vacuumize to obtain fluorescent glue; dispense glue, use a glue dispenser to evenly coat the fluorescent glue on the inner ...

Claims

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Application Information

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IPC IPC(8): H01L33/50
CPCH01L33/501H01L33/502H01L33/504H01L2933/0041
Inventor 李立勉张智胡鹏飞张纯现陈涛夏明唐龙江小龙曹聪陈育
Owner 广东晶锐半导体有限公司
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