Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device, which relates to the technical field of display and improves the packaging effect and reliability of the display panel. The display panel comprises a display area, non-display area, a cathode layer and a negative power supply bus, wherein the non-display area includes a lower step area, the lower step area includes a sector area and a binding area, the sector area is provided with a fan-out wire, and the binding area is provided with negative power supply pads; the cathode layer includes a cathode connecting part located in the lower step area; the negative power supply bus is located in the lower step area; the lower step area further includes a cathode contact area, and the negative power supply bus is connected with the cathode connecting part in the cathode contact area; the lower step area is provided with a negative power supply connecting part, the negative power supply connecting part and the fan-outwire are arranged in different layers, the negative power supply connecting part is electrically connected with the negative power supply bus and one negative power supply pad; and the negative powersupply connecting part includes a plurality of first connecting parts which extend along a first direction and are arranged along a second direction, and there is an interval between two adjacent first connecting parts.

Description

[0001] 【Technical field】 [0002] The present invention relates to the field of display technology, in particular to a display panel and a display device. [0003] 【Background technique】 [0004] In order to prevent water and oxygen from corroding the devices in the display panel, an encapsulation glue is usually provided in the display panel. During the encapsulation process, the encapsulation glue is irradiated with laser to make it melt and solidify, so as to realize the encapsulation of the display panel. [0005] Usually, the non-display area of ​​the display panel includes the lower step area, such as figure 1 as shown, figure 1 It is a partial cross-sectional view of a display panel in the prior art. The lower step area is provided with a negative power signal line 1' and a fan-out line 2', and the fan-out line 2' is arranged in different layers. In the prior art, based on the arrangement of the negative power signal line 1', there will be a large overlap between the n...

AI Technical Summary

Problems solved by technology

In the prior art, based on the arrangement of the negative power signal line 1', there will be a large overlap between the negative power signal line 1' and the fan-out wiring 2' in a local area. The film layer formed by stacking the power signal line 1' and the fan-out line 2' is not flat, and there is a large height difference between the area where the negative power signal line 1' is located and others, which makes the height of the encapsulation glue 3' covered on it uneven. , when the encapsulation adhesive 3' is melted and solidified, the deformation and stress caused by the thermal expansion and contraction of the encapsulation adhesive 3' at different positions are different, so that the encapsulation adhesive 3' is prone to wrinkle at the position with high stress, which reduces the reliability of the encapsulation ; On the other hand, when the encapsulation glue 3' is sintered by laser, it is blocked by the negative power signal line 1', and the reflection path of the laser in a local area is too short, which is obviously different from the reflection path in other areas, which affects the encapsulation glue 3 'The sintering uniformity, the packaging glue 3' is prone to cracks in high temperature and high humidity environment, resulting in package failure

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