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Method for embedding chip into glassware

A technology of glassware and chips, which is applied in the direction of drinking water vessels, etc., can solve the problems of high melting point and damaged chips, and achieve the effect of long shelf life

Pending Publication Date: 2019-08-16
重庆五盾科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the problem that the chip is damaged due to the high melting point of the glassware during the production process of the embedded chip

Method used

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  • Method for embedding chip into glassware
  • Method for embedding chip into glassware
  • Method for embedding chip into glassware

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Embodiment Construction

[0022] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments, but it is not used as a basis for limiting the present invention.

[0023] A method for embedding a chip in a glass vessel, comprising combining an upper cup body 1, a blocking body 2, a lower cup body 3, and a first groove 4 into an independent mold, and the independent mold is used as the first glass vessel. A main body; the fastening base 5, the fastening protrusion 6, the second groove 8, the spring 7, and the chip 9 are combined into another device as the second main body of the vessel; the second main body is embedded in the first The lower cup 3 of the first main body cannot be taken out again, and the chip 9 is embedded in the second groove 8 of the second main body, and the second groove 8 is connected to the inner wall surface of the lower...

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Abstract

The invention discloses a method for embedding a chip into glassware. The method is characterized in that an upper cup body, a blocking body, a lower cup body and a first groove are combined into an independent mold which serves as a first main body of the glassware; a buckling base, a buckling protrusion, a second groove, a spring and the chip are combined into another device which serves as a second main body of the glassware; the second main body cannot be taken out after being embedded into the lower cup body of the second main body, the chip is embedded into the second groove, the secondgroove and the inner wall of the lower cup body of the first main body form a separate closed space, the chip is protected, and facing the glassware, a user can read or write data from or into the chip embedded in the glassware. The problem that in the production process of embedding a chip into glassware, the chip is damaged due to the high melting point is solved. By means of the method, the chip can be safely embedded into the glassware, and meanwhile the embedded chip has anti-destruction, anti-alteration, anti-transfer and anti-wash properties, has high temperature resistance and acid andalkali resistance, and is long in storage life.

Description

technical field [0001] The present invention belongs to the field of chip packaging, and specifically relates to a method for embedding a chip in a glass container. Background technique [0002] Currently on the market, the solution to assigning chips to glassware generally adopts that the chip is labeled on the glassware or made into a chip and listed on the glassware. The purpose is to allow users to accurately and quickly query, monitor, trace, and track data information associated with current glassware products through chips, so that glassware is also endowed with a unique identity. To achieve the purpose of information entry, data collection, anti-counterfeiting traceability, and circulation supervision. However, due to the external way of labeling, it is easy to be destroyed, forged, altered, and transferred. Moreover, the label is in contact with the air for a long time, which shortens the service life of the chip label. In the daily disinfection process of reusabl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A47G19/22
CPCA47G19/2227
Inventor 王俊蘅
Owner 重庆五盾科技有限公司
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