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Chip assembly and mobile terminal

A chip module and chip technology, applied in the field of chip components and mobile terminals, can solve the problems of difficult structural design of mobile terminals, poor chip grounding effect, etc., and achieve the effect of reducing structural design difficulty, small space, and good grounding effect.

Inactive Publication Date: 2019-08-02
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention discloses a chip component and a mobile terminal to solve the problems that the structural design of the mobile terminal is relatively difficult and the grounding effect of the chip is not good

Method used

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  • Chip assembly and mobile terminal
  • Chip assembly and mobile terminal
  • Chip assembly and mobile terminal

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Embodiment Construction

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0023] Such as Figure 1-Figure 3 As shown, the embodiment of the present invention discloses a mobile terminal, which includes a housing (not shown in the figure) and a chip component. The chi...

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Abstract

The invention discloses a chip assembly and a mobile terminal. The chip assembly comprises a mainboard, a chip module, and a mainboard device; the chip module comprises a chip, a circuit board and a reinforced shield plate, the chip is arranged on the circuit board, the circuit board is arranged on the reinforced shield plate, the reinforced shield plate is in grounding connection with the mainboard, and a device installation space is formed between the reinforced shield plate and the mainboard; and the mainboard device is mounted in the device installation space. The reinforced shield plate can reinforce the chip and circuit board, and is in grounding connection with the mainboard to shield the mainboard device mounted on the mainboard, the mainboard does not need an extra shield cover, and conductive foam between the reinforced shield plate and the shield cover can be omitted. Thus, the stacked chip module and mainboard occupies small space, other devices in the mobile terminal are easier to arrange, and structural design of the mobile terminal is less difficult. The chip is grounded via the reinforced shield plate directly, and the grounding effect is better.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a chip component and a mobile terminal. Background technique [0002] With the rapid development of the mobile terminal industry, the performance of the mobile terminal is continuously improved, and its integrated functions are becoming more and more diversified, which poses a great challenge to the internal space of the mobile terminal. [0003] Taking the fingerprint module as an example, the fingerprint module mainly includes a fingerprint chip, a fingerprint circuit board and a reinforcement board. The fingerprint circuit board is arranged between the fingerprint chip and the reinforcement board. connected and grounded, and the main board shielding cover is arranged on the main board of the mobile terminal to realize the shielding function. [0004] However, when the above-mentioned structure is adopted, the space occupied by the overlapping of the reinforcement plate,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00G06K9/00
CPCH05K9/0022G06V40/1365
Inventor 杨子东
Owner VIVO MOBILE COMM CO LTD
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