Hot spot temperature analysis method for isolating switch dynamic capacity increase
A technology of isolating switch and hot spot temperature, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve problems such as poor real-time performance and large amount of calculation, and achieve improved calculation accuracy, simple calculation process, and good economic benefits. Effect
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[0044] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment, and other embodiments may also belong to the scope of the present invention as long as they conform to the gist of the present invention.
[0045] In a preferred embodiment of the present invention, based on the above-mentioned problems in the prior art, a hot spot temperature analysis method for dynamic capacity increase of an isolating switch is now provided, such as figure 1 As shown, it specifically includes the following steps:
[0046] Step S1, performing a thermodynamic analysis on the isolating switch, and establishing a steady-state thermal circuit model of the isolating switch according to the analysis results and external environmental parameters. The steady-state thermal circuit model includes several thermodynamic parameters;
[0047] Step S2, performing physical modeling on...
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